OPA4227UA Texas Instruments IC OPAMP GP 8MHZ 14SOIC

label:
2023/12/13 290


• Low noise: 3 nV/√Hz
• Wide bandwidth:
   – OPA227: 8 MHz, 2.3 V/μs
   – OPA228: 33 MHz, 10 V/μs
• Settling time: 5 μs
• High CMRR: 138 dB
• High open-loop gain: 160 dB
• Low input bias current: 10 nA maximum
• Low offset voltage: 75 µV maximum
• Single, dual, and quad versions


CATALOG
OPA4227UA COUNTRY OF ORIGIN
OPA4227UA PARAMETRIC INFO
OPA4227UA PACKAGE INFO
OPA4227UA MANUFACTURING INFO
OPA4227UA PACKAGING INFO
OPA4227UA ECAD MODELS
OPA4227UA FUNCTIONAL BLOCK DIAGRAM  
OPA4227UA APPLICATIONS


COUNTRY OF ORIGIN
Taiwan (Province of China)
Philippines
Malaysia
Thailand


PARAMETRIC INFO
Manufacturer Type Precision Amplifier
Type Precision Amplifier
Minimum Single Supply Voltage (V) 4.5
Number of Channels per Chip 4
Process Technology Bipolar
Minimum PSRR (dB) 126.02(Typ)
Typical Single Supply Voltage (V) 30
Maximum Single Supply Voltage (V) 36
Maximum Quiescent Current (mA) 15.2@±15V
Minimum Dual Supply Voltage (V) ±2.5
Typical Gain Bandwidth Product (MHz) 8
Maximum Input Offset Voltage (mV) 0.2@±15V
Typical Dual Supply Voltage (V) ±15
Maximum Input Offset Current (uA) 0.01@±15V
Maximum Dual Supply Voltage (V) ±18
Maximum Operating Supply Voltage (V) ±18|36
Maximum Input Bias Current (uA) 0.01@±15V
Minimum CMRR (dB) 120
Maximum Supply Voltage Range (V) 36 to 37
Minimum CMRR Range (dB) >=115
Typical Voltage Gain (dB) 160
Typical Slew Rate (V/us) 2.3@±15V
Typical Settling Time (ns) 5600
Typical Output Current (mA) 45
Typical Input Noise Voltage Density (nV/rtHz) 3.5@±15V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.4@±15V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Power Supply Type Single|Dual
 
PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 8.75(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 8.75(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AB
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 2|3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 50
Packaging Document Link to Datasheet
 
ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM  


APPLICATIONS
• Data acquisition (DAQ)
• Condition monitoring sensor
• Spectrum analyzer
• Professional audio amplifier (rack mount)  
• Industrial AC-DC

Продукт RFQ