OPA4340UA/2K5 Texas Instruments IC OP AMP GP 5.5MHZ RRIO 14SOIC

label:
2023/11/17 357


• Rail-to-Rail Input
• Rail-to-Rail Output (Within 1 mV)
• MicroSize Packages
• Wide Bandwidth: 5.5 MHz
• High Slew Rate: 6 V/µs
• Low THD + Noise: 0.0007% (f = 1 kHz)
• Low Quiescent Current: 750 µA/Channel  
• Single, Dual, and Quad Versions


CATALOG
OPA4340UA/2K5 COUNTRY OF ORIGIN
OPA4340UA/2K5 PARAMETRIC INFO
OPA4340UA/2K5 PACKAGE INFO
OPA4340UA/2K5 MANUFACTURING INFO
OPA4340UA/2K5 PACKAGING INFO
OPA4340UA/2K5 ECAD MODELS
OPA4340UA/2K5 FUNCTIONAL BLOCK DIAGRAM
OPA4340UA/2K5 APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Manufacturer Type Precision Amplifier
Type Precision Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 2.7
Number of Channels per Chip 4
Process Technology CMOS
Minimum PSRR (dB) 90.46(Typ)
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Output Type CMOS
Typical Gain Bandwidth Product (MHz) 5.5
Maximum Input Offset Voltage (mV) 0.5@5V
Maximum Input Offset Current (uA) 0.00001@5V
Maximum Operating Supply Voltage (V) 5.5
Maximum Input Bias Current (uA) 0.00001@5V
Minimum CMRR (dB) 70
Maximum Supply Voltage Range (V) 5.5 to 6
Minimum CMRR Range (dB) 70 to 71
Typical Voltage Gain (dB) 124
Typical Slew Rate (V/us) 6@5V
Typical Input Offset Current (uA) 0.0000002@5V
Typical Settling Time (ns) 1600
Typical Input Noise Voltage Density (nV/rtHz) 25@5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.003@5V
Typical Input Bias Current (uA) 0.0000002@5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Power Supply Type Single
 
PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 8.75(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 8.75(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AB
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Suffix 2K5
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 16.4
Tape Pitch (mm) 8
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet
 
ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM


APPLICATIONS
• Driving A/D Converters  
• PCMCIA Cards
• Data Acquisition
• Process Control
• Audio Processing  
• Communications
• Active Filters
• Test Equipment


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