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• Rail-to-Rail Input |
• Rail-to-Rail Output (Within 1 mV) |
• MicroSize Packages |
• Wide Bandwidth: 5.5 MHz |
• High Slew Rate: 6 V/µs |
• Low THD + Noise: 0.0007% (f = 1 kHz) |
• Low Quiescent Current: 750 µA/Channel
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• Single, Dual, and Quad Versions |
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CATALOG |
OPA4340UA/2K5 COUNTRY OF ORIGIN |
OPA4340UA/2K5 PARAMETRIC INFO |
OPA4340UA/2K5 PACKAGE INFO |
OPA4340UA/2K5 MANUFACTURING INFO |
OPA4340UA/2K5 PACKAGING INFO |
OPA4340UA/2K5 ECAD MODELS |
OPA4340UA/2K5 FUNCTIONAL BLOCK DIAGRAM |
OPA4340UA/2K5 APPLICATIONS |
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COUNTRY OF ORIGIN |
Malaysia |
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PARAMETRIC INFO |
Manufacturer Type |
Precision Amplifier |
Type |
Precision Amplifier |
Rail to Rail |
Rail to Rail Input/Output |
Minimum Single Supply Voltage (V) |
2.7 |
Number of Channels per Chip |
4 |
Process Technology |
CMOS |
Minimum PSRR (dB) |
90.46(Typ) |
Typical Single Supply Voltage (V) |
3|5 |
Maximum Single Supply Voltage (V) |
5.5 |
Output Type |
CMOS |
Typical Gain Bandwidth Product (MHz) |
5.5 |
Maximum Input Offset Voltage (mV) |
0.5@5V |
Maximum Input Offset Current (uA) |
0.00001@5V |
Maximum Operating Supply Voltage (V) |
5.5 |
Maximum Input Bias Current (uA) |
0.00001@5V |
Minimum CMRR (dB) |
70 |
Maximum Supply Voltage Range (V) |
5.5 to 6 |
Minimum CMRR Range (dB) |
70 to 71 |
Typical Voltage Gain (dB) |
124 |
Typical Slew Rate (V/us) |
6@5V |
Typical Input Offset Current (uA) |
0.0000002@5V |
Typical Settling Time (ns) |
1600 |
Typical Input Noise Voltage Density (nV/rtHz) |
25@5V |
Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.003@5V |
Typical Input Bias Current (uA) |
0.0000002@5V |
Shut Down Support |
No |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Power Supply Type |
Single |
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PACKAGE INFO |
Supplier Package |
SOIC |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
14 |
Lead Shape |
Gull-wing |
PCB |
14 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
8.75(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
8.75(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC |
Package Family Name |
SO |
Jedec |
MS-012AB |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
2K5 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
16.4 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
16 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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FUNCTIONAL BLOCK DIAGRAM |
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APPLICATIONS |
• Driving A/D Converters
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• PCMCIA Cards |
• Data Acquisition |
• Process Control |
• Audio Processing
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• Communications |
• Active Filters |
• Test Equipment |
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