OPA454AIDDAR Texas Instruments IC OPAMP GP 2.5MHZ 8SOPWRPAD

label:
2024/01/17 290


• Wide Power-Supply Range: ±5 V (10 V) to ±50 V (100 V)  
• High-Output Load Drive: IO > ±50 mA
• Wide Output Voltage Swing: 1 V to Rails
• Independent Output Disable or Shutdown
• Wide Temperature Range: –40°C to +85°C  
• 8-Pin SO Package


CATALOG
OPA454AIDDAR COUNTRY OF ORIGIN
OPA454AIDDAR PARAMETRIC INFO
OPA454AIDDAR PACKAGE INFO  
OPA454AIDDAR MANUFACTURING INFO  
OPA454AIDDAR PACKAGING INFO
OPA454AIDDAR ECAD MODELS    
OPA454AIDDAR FUNCTIONAL BLOCK DIAGRAM
OPA454AIDDAR APPLICATIONS


COUNTRY OF ORIGIN
China
Thailand


PARAMETRIC INFO
Manufacturer Type High Voltage Amplifier
Type High Voltage Amplifier
Minimum Single Supply Voltage (V) 10
Number of Channels per Chip 1
Minimum PSRR (dB) 92.04(Typ)
Typical Single Supply Voltage (V) 9|12|15|18|24|28
Maximum Single Supply Voltage (V) 100
Maximum Quiescent Current (mA) 4@±50V
Minimum Dual Supply Voltage (V) ±5
Typical Gain Bandwidth Product (MHz) 2.5
Maximum Input Offset Voltage (mV) 4@±50V
Typical Dual Supply Voltage (V) ±50
Maximum Input Offset Current (uA) 0.0001@±50V
Maximum Dual Supply Voltage (V) ±50
Maximum Operating Supply Voltage (V) ±50|100
Maximum Input Bias Current (uA) 0.0001@±50V
Minimum CMRR (dB) 100
Maximum Supply Voltage Range (V) >=44
Minimum CMRR Range (dB) 95 to 105
Typical Voltage Gain (dB) 130
Typical Slew Rate (V/us) 13@±50V
Typical Input Offset Current (uA) 0.0000002@±50V
Typical Settling Time (ns) 10000
Typical Input Noise Voltage Density (nV/rtHz) 300@±50V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.04@±50V
Typical Input Bias Current (uA) 0.0000014@±50V
Shut Down Support No
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 125
Power Supply Type Single|Dual
 
PACKAGE INFO
Supplier Package HSOIC EP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.55(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.7(Max)
Seated Plane Height (mm) 1.7(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Heat Sinked Small Outline Package, Exposed Pad
Package Family Name SO
Jedec MS-012-BA
 
MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R
 
PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
 
ECAD MODELS  


FUNCTIONAL BLOCK DIAGRAM


APPLICATIONS
• Test Equipment
• Avalanche Photodiode: High-V Current Sense
• Piezoelectric Cells
• Transducer Drivers
• Servo Drivers  
• Audio Amplifiers
• High-Voltage Compliance Current Sources  
• General High-Voltage Regulators and Power

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