OPA544T Texas Instruments High-Voltage, High-Current OPERATIONAL AMPLIFIER

label:
2024/03/13 246



• HIGH OUTPUT CURRENT: 2A min
• WIDE POWER SUPPLY RANGE:±10 to ±35V
• SLEW RATE: 8V/µs
• INTERNAL CURRENT LIMIT
• THERMAL SHUTDOWN PROTECTION
• FET INPUT: IB = 100pA max
• 5-LEAD TO-220 PLASTIC PACKAGE
• 5-LEAD SURFACE MOUNT PACKAGE


CATALOG
OPA544T COUNTRY OF ORIGIN
OPA544T PARAMETRIC INFO
OPA544T PACKAGE INFO
OPA544T MANUFACTURING INFO
OPA544T PACKAGING INFO
OPA544T EACD MODELS
OPA544T APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
China
Thailand
China Hong Kong
Philippines


PARAMETRIC INFO
Manufacturer Type High Output Current Amplifier
type High Output Current Amplifier
Number of Channels per Chip 1
Minimum Dual Supply Voltage (V) ±10
Typical Gain Bandwidth Product (MHz) 1.4
Maximum Input Offset Voltage (mV) 5@±35V
Typical Dual Supply Voltage (V) ±12|±15|±18|±24|±28
Maximum Input Offset Current (uA) 0.0001@±35V
Maximum Dual Supply Voltage (V) ±35
Maximum Operating Supply Voltage (V) ±35
Maximum Input Bias Current (uA) 0.0001@±35V
Minimum CMRR (dB) 90
Maximum Supply Voltage Range (V) >=44
Minimum CMRR Range (dB) 90 to 95
Typical Voltage Gain (dB) 103
Typical Slew Rate (V/us) 8@±35V
Typical Settling Time (ns) 2500
Typical Input Noise Voltage Density (nV/rtHz) 36@±35V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.003@±35V
Shut Down Support no
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Rating Extended Industrial
Minimum Storage Temperature (°C) -40
Maximum Storage Temperature (°C) 125
Power Supply Type Dual


PACKAGE INFO
Supplier packaging TO-220
Basic package type Through Hole
Number of pins 5
PCB 5
ears ears
Pin spacing (mm) 1.7
Package length (mm) 10.67(Max)
Package width (mm) 4.83(Max)
Package height (mm) 9.25(Max)
Package diameter (mm) N/R
Mounting surface height (mm) 16.51(Max)
Install Through Hole
Package weight (g) not applicable
Packaging materials Plastic
package instruction Transistor Outline Package
Package series name TO
JEDEC TO-220AB
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1
Maximum reflow temperature (°C) N/R
Reflow soldering time (seconds) N/R
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) not applicable
Wave soldering time (seconds) not applicable
Lead Finish(Plating) Matt Sn
Plating materials not applicable
Terminal Base Material Cu


PACKAGING INFO
Package Tube
Packing quantity 49


ECAD MODELS



APPLICATIONS
• MOTOR DRIVER
• PROGRAMMABLE POWER SUPPLY
• SERVO AMPLIFIER
• VALVES, ACTUATOR DRIVER
• MAGNETIC DEFLECTION COIL DRIVER
• AUDIO AMPLIFIER
Продукт RFQ