OPA551UA/2K5 Texas Instruments OPA55x High-Voltage, High-Current Operational Amplifiers

label:
2024/01/17 261



• Wide Supply Range: ±4 V to ±30 V
• High Output Current: 200 mA Continuous
• Low Noise: 14 nV/√Hz
• Thermal Shutdown Indicator
• Wide Output Swing: 2 V from Rail
• Packages: PDIP-8, SOIC-8, or DDPAK/TO-263-7


CATALOG
OPA551UA/2K5 COUNTRY OF ORIGIN
OPA551UA/2K5 PARAMETRIC INFO
OPA551UA/2K5 PACKAGE INFO
OPA551UA/2K5 MANUFACTURING INFO
OPA551UA/2K5 PACKAGING INFO
OPA551UA/2K5 ECAD MODELS
OPA551UA/2K5 APPLICATIONS


COUNTRY OF ORIGIN
Philippines
Malaysia
Thailand
China
United States of America
Taiwan (Province of China)


PARAMETRIC INFO
Manufacturer Type High Output Current Amplifier
Type High Output Current Amplifier
Minimum Single Supply Voltage (V) 8
Number of Channels per Chip 1
Minimum PSRR (dB) 100(Typ)
Typical Single Supply Voltage (V) 12|15|18|24|28
Maximum Single Supply Voltage (V) 60
Maximum Quiescent Current (mA) 8.5@±30V
Minimum Dual Supply Voltage (V) ±4
Typical Gain Bandwidth Product (MHz) 3
Maximum Input Offset Voltage (mV) 3@±30V
Typical Dual Supply Voltage (V) ±30
Maximum Input Offset Current (uA) 0.0001@±30V
Maximum Dual Supply Voltage (V) ±30
Maximum Input Voltage Range (V) -0.5 to 0.5
Maximum Operating Supply Voltage (V) ±30|60
Maximum Input Bias Current (uA) 0.0001@±30V
Minimum CMRR (dB) 92
Maximum Supply Voltage Range (V) >=44
Minimum CMRR Range (dB) 90 to 95
Typical Voltage Gain (dB) 126
Typical Slew Rate (V/us) 15@±30V
Typical Settling Time (ns) 2000
Typical Output Current (mA) 200(Min)@±30V
Typical Input Noise Voltage Density (nV/rtHz) 14@±30V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.0035@±30V
Typical Input Bias Current (uA) 0.00002@±30V
Shut Down Support Yes
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single|Dual


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.98(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix 2K5
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Telephony
• Test Equipment
• Audio Amplifiers
• Transducer Excitation
• Servo Drivers

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