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OPA551UA Texas Instruments IC OPAMP GP 3MHZ 8SOIC

label:
2023/08/29 325

 
• Wide Supply Range: ±4 V to ±30 V
• High Output Current: 200 mA Continuous
• Low Noise: 14 nV/√Hz
• Fully Protected:
   – Thermal Shutdown
   – Output Current-Limited
• Thermal Shutdown Indicator
• Wide Output Swing: 2 V from Rail  
• Fast Slew Rate:
   – OPA551: 15 V/µs
   – OPA552: 24 V/µs
• Wide Bandwidth:
   – OPA551: 3 MHz
   – OPA552: 12 MHz
• Packages: PDIP-8, SOIC-8, or DDPAK/TO-263-7

 
CATALOS
OPA551UA COUNTRY OF ORIGIN
OPA551UA PARAMETRIC INFO
OPA551UA PACKAGE INFO
OPA551UA MANUFACTURING INFO
OPA551UA PACKAGING INFO
OPA551UA ECAD MODELS
OPA551UA APPLICATIONS

 
COUNTRY OF ORIGIN
China
Malaysia
Philippines
Taiwan (Province of China)
Thailand
United States of America

 
PARAMETRIC INFO
Manufacturer Type High Output Current Amplifier
Type High Output Current Amplifier
Minimum Single Supply Voltage (V) 8
Number of Channels per Chip 1
Minimum PSRR (dB) 100(Typ)
Typical Single Supply Voltage (V) 12|15|18|24|28
Maximum Single Supply Voltage (V) 60
Maximum Quiescent Current (mA) 8.5@±30V
Minimum Dual Supply Voltage (V) ±4
Typical Gain Bandwidth Product (MHz) 3
Maximum Input Offset Voltage (mV) 3@±30V
Typical Dual Supply Voltage (V) ±30
Maximum Input Offset Current (uA) 0.0001@±30V
Maximum Dual Supply Voltage (V) ±30
Maximum Input Voltage Range (V) -0.5 to 0.5
Maximum Operating Supply Voltage (V) ±30|60
Maximum Input Bias Current (uA) 0.0001@±30V
Minimum CMRR (dB) 92
Maximum Supply Voltage Range (V) >=44
Minimum CMRR Range (dB) 90 to 95
Typical Voltage Gain (dB) 126
Typical Slew Rate (V/us) 15@±30V
Typical Settling Time (ns) 2000
Typical Output Current (mA) 200(Min)@±30V
Typical Input Noise Voltage Density (nV/rtHz) 14@±30V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.0035@±30V
Typical Input Bias Current (uA) 0.00002@±30V
Shut Down Support Yes
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single|Dual
 
PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.98(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 75
Packaging Document Link to Datasheet
 
ECAD MODELS

 
APPLICATIONS
• Telephony
• Test Equipment
• Audio Amplifiers
• Transducer Excitation
• Servo Drivers


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