OPA633KP Texas Instruments IC OPAMP VFB 260MHZ 8DIP

label:

2025/04/14 0

OPA633KP Texas Instruments IC OPAMP VFB 260MHZ 8DIP

• WIDE BANDWIDTH: 260MHz

• HIGH SLEW RATE: 2500V/µs

• HIGH OUTPUT CURRENT: 100mA

• LOW OFFSET VOLTAGE: 1.5mV

CATALOG

OPA633KP COUNTRY OF ORIGIN

OPA633KP PARAMETRIC INFO

OPA633KP PACKAGE INFO

OPA633KP MANUFACTURING INFO

OPA633KP PACKAGING INFO

OPA633KP ECAD MODELS

OPA633KP APPLICATIONS

COUNTRY OF ORIGIN

Thailand

PARAMETRIC INFO

Manufacturer Type	Buffer Amplifier
Type	Buffer Amplifier
Number of Channels per Chip	1
Minimum Dual Supply Voltage (V)	±5
Maximum Quiescent Current (mA)	25@±12V
Maximum Input Offset Voltage (mV)	15@±12V
Typical Dual Supply Voltage (V)	±12
Maximum Dual Supply Voltage (V)	±16
Maximum Input Bias Current (uA)	35@±12V
Maximum Operating Supply Voltage (V)	±16
Maximum Supply Voltage Range (V)	32 to 36
Typical Slew Rate (V/us)	2500@12V
Typical Settling Time (ns)	50
Typical Output Current (mA)	100@±12V
Typical Input Bias Current (uA)	15@±12V
Shut Down Support	No
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	75
Minimum Storage Temperature (°C)	-40
Maximum Storage Temperature (°C)	85
Power Supply Type	Dual
Maximum Power Dissipation (mW)	1950

Supplier Package	PDIP
Basic Package Type	Through Hole
Pin Count	8
Lead Shape	Through Hole
PCB	8
Tab	N/R
Pin Pitch (mm)	2.54
Package Length (mm)	10.16(Max)
Package Width (mm)	6.6(Max)
Package Height (mm)	5.08(Max) - 0.51(Min)
Package Diameter (mm)	N/R
Package Overall Length (mm)	10.16(Max)
Package Overall Width (mm)	10.92(Max)
Package Overall Height (mm)	5.08(Max)
Seated Plane Height (mm)	5.08(Max)
Mounting	Through Hole
Package Material	Plastic
Package Description	Plastic Dual In Line Package
Package Family Name	DIP
Jedec	MS-001BA
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	N/R
Maximum Reflow Temperature (°C)	N/R
Reflow Solder Time (Sec)	N/R
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/A
Wave Solder Time (Sec)	N/A
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy

Packaging	Tube
Quantity Of Packaging	50
Packaging Document	Link to Datasheet

• OP AMP CURRENT BOOSTER

• VIDEO BUFFER

• LINE DRIVER

• A/D CONVERTER INPUT BUFFER