|
|
• unity-gain bandwidth: 400mhz
|
• gain-bandwidth product: 200mhz
|
• lowinputvoltagenoise: 2.6nv/√hz
|
• verylowdistortion:–93dbc (5mhz)
|
• highopen-loop gain: 110db
|
• fast12-bit settling: 22ns (0.01%)
|
• lowdcvoltageoffset:300mv typical
|
• professional level diff gain/phase
error: 0.003%/0.008°
|
|
| CATALOG |
OPA842IDR COUNTRY OF ORIGIN
|
OPA842IDR PARAMETRIC INFO
|
OPA842IDR PACKAGE INFO
|
OPA842IDR MANUFACTURING INFO
|
OPA842IDR PACKAGING INFO
|
OPA842IDR ECAD MODELS
|
OPA842IDR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
|
PARAMETRIC INFO
|
| Manufacturer Type |
High Speed Amplifier |
| Type |
High Speed Amplifier |
| Number of Channels per Chip |
1 |
| Process Technology |
BiCOM |
| Minimum PSRR (dB) |
90 |
| Maximum Quiescent Current (mA) |
20.8@±5V |
| Minimum Dual Supply Voltage (V) |
±5 |
| Typical Gain Bandwidth Product (MHz) |
200 |
| Maximum Input Offset Voltage (mV) |
1.2@±5V |
| Typical Dual Supply Voltage (V) |
±5 |
| Maximum Input Offset Current (uA) |
1@±5V |
| Maximum Dual Supply Voltage (V) |
±6 |
| Maximum Operating Supply Voltage (V) |
±6 |
| Maximum Input Bias Current (uA) |
35@±5V |
| Minimum CMRR (dB) |
85 |
| Maximum Supply Voltage Range (V) |
12 to 12.5 |
| Minimum CMRR Range (dB) |
85 to 90 |
| Typical Voltage Gain (dB) |
110 |
| Typical Slew Rate (V/us) |
400@±15V |
| Typical Settling Time (ns) |
22 |
| Typical Output Current (mA) |
100@±5V |
| Typical Input Noise Voltage Density (nV/rtHz) |
2.6@±5V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) |
2.7@±5V |
| Shut Down Support |
No |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Power Supply Type |
Dual |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• adc/dacbuffer driver
|
| • lowdistortion if amplifier |
| • active filter configuration |
| • low-noise differential receiver |
• high-resolution imaging
|
• testinstrumentation
|
• professional audio
|
• opa642upgrade
|
| |
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