P6SMB27A Littelfuse TVS DIODE 23.1V 37.5V DO214AA

label:
2025/10/11 20
P6SMB27A Littelfuse TVS DIODE 23.1V 37.5V DO214AA


■ 600 W peak pulse power capability at 10/1000 μs waveform, repetition rate (duty cycles):0.01 %
■ Low dynamic resistance
■ Optimized surface mount footprint for minimal PCB space impact
■ Typical failure mode is short from over-specified voltage or current
■ Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c pass Class 1 and Class 2


CATALOG
P6SMB27A COUNTRY OF ORIGIN
P6SMB27A PARAMETRIC INFO
P6SMB27A PACKAGE INFO
P6SMB27A MANUFACTURING INFO
P6SMB27A PACKAGING INFO
P6SMB27A ECAD MODELS
P6SMB27A APPLICATIONS


COUNTRY OF ORIGIN
China
Philippines


PARAMETRIC INFO
Configuration Single
Direction Type Uni-Directional
Maximum Reverse Stand-Off Voltage (V) 23.1
Minimum Breakdown Voltage (V) 25.7
Maximum Clamping Voltage (V) 37.5
Maximum Reverse Leakage Current (uA) 1
Maximum Breakdown Voltage (V) 28.4
Number of Elements per Chip 1
Maximum Peak Pulse Current (A) 16.3
Test Current (mA) 1
Operating Junction Temperature (°C) -65 to 150
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 175
Maximum Power Dissipation (mW) 5000
Maximum Forward Voltage (V) 3.5
Peak Pulse Power Dissipation (W) 600
Minimum Operating Temperature (°C) -65
Maximum Operating Temperature (°C) 150
Peak Forward Surge Current (A) 100


PACKAGE INFO
Supplier Package SMB
Basic Package Type Lead-Frame SMT
Pin Count 2
Lead Shape J-Lead
PCB 2
Tab N/R
Pin Pitch (mm) N/R
Package Length (mm) 4.57(Max)
Package Width (mm) 3.94(Max)
Package Height (mm) 2.24(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 2.44(Max)
Mounting Surface Mount
Package Material Plastic
Package Description SMD Plastic Package
Package Family Name DO
Jedec DO-214AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 3000
 
ECAD MODELS


APPLICATIONS
TVS devices are ideal for the protection of I/O Interfaces, VCC bus
and other vulnerable circuits used in Telecom, Computer, Industrial
and Consumer electronic applications
Продукт RFQ