|
|
• Operating Power-Supply Voltage Range of 3 V to 12 V
|
• Supports Bidirectional Data Transfer of I2C Bus Signals
|
• Allows Bus Capacitance of 400 pF on Main I2C Bus (Sx/Sy Side) and 3000 pF on Transmission Side (Lx/Ly Side)
|
• Dual Bidirectional Unity-Voltage-Gain Buffer With No External Directional Control Required
|
• Drives 10× Lower-Impedance Bus Wiring for Improved Noise Immunity
|
• Latch-up Performance Exceeds 100 mA Per JESD 78, Class II
|
|
| CATALOG |
P82B715D COUNTRY OF ORIGIN
|
| P82B715D LIFECYCLE |
P82B715D PARAMETRIC INFO
|
P82B715D PACKAGE INFO
|
P82B715D MANUFACTURING INFO
|
P82B715D PACKAGING INFO
|
P82B715D ECAD MODELS
|
P82B715D APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
|
| LIFECYCLE |
Obsolete
Mar 20,2024 |
|
PARAMETRIC INFO
|
| Maximum Operating Supply Voltage (V) |
12 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Typical Operating Supply Voltage (V) |
5|9 |
| Maximum Supply Current (mA) |
60 |
| Type |
Buffer |
| Input Signal Type |
I2C |
| Maximum Clock Frequency (kHz) |
400 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-55 |
| Temperature Flag |
Opr |
| Maximum Storage Temperature (°C) |
125 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| C |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
75 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
 |
|
| APPLICATIONS |
| • HDMI DDC |
| • Long I2C Communications |
| • Industrial Communications |
| |
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