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• 12-clock operation with selectable 6-clock operation (via software or via parallel programmer)
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• Memory addressing capability– Up to 64 kbytes ROM and 64 kbytes RAM
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• CMOS and TTL compatible
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• PLCC, DIP, TSSOP or LQFP packages
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• Extended temperature ranges
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| CATALOG |
P87C51X2FA,512 LIFECYCLE
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P87C51X2FA,512 PARAMETRIC INFO
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P87C51X2FA,512 PACKAGE INFO
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P87C51X2FA,512 MANUFACTURING INFO
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P87C51X2FA,512 PACKAGING INFO
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LIFECYCLE
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Obsolete
Jun 30,2016
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PARAMETRIC INFO
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| Family Name |
P87 |
| Data Bus Width (bit) |
8 |
| Device Core |
80C51 |
| Instruction Set Architecture |
CISC |
| Maximum Clock Rate (MHz) |
33 |
| Program Memory Type |
EPROM |
| Program Memory Size |
4KB |
| RAM Size |
128B |
| Maximum Expanded Memory Size |
64KB |
| Maximum CPU Frequency (MHz) |
33 |
| Number of Programmable I/Os |
32 |
| Number of Timers |
3 |
| Core Architecture |
8051 |
| PWM |
1 |
| Watchdog |
1 |
| Special Features |
Programmable Counter Array |
| Interface Type |
UART |
| Programmability |
Yes |
| SPI |
0 |
| I2C |
0 |
| Process Technology |
CMOS |
| I2S |
0 |
| UART |
1 |
| USART |
0 |
| CAN |
0 |
| USB |
0 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
1500 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Typical Operating Supply Voltage (V) |
5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Extended |
| Operating Supply Voltage (V) |
5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
PLCC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
44 |
| Lead Shape |
J-Lead |
| PCB |
44 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
16.66(Max) |
| Package Width (mm) |
16.66(Max) |
| Package Height (mm) |
3.68(Min) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
4.57(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Plastic Leaded Chip Carrier |
| Package Family Name |
LCC |
| Jedec |
MS-018AC |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
,512 |
| Packaging |
Tube |
| Quantity Of Packaging |
1300 |
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