P89LPC931FDH NXP IC MCU 8BIT

label:
2025/06/3 11
P89LPC931FDH NXP IC MCU 8BIT


CATALOG
P89LPC931FDH COUNTRY OF ORIGIN
P89LPC931FDH PARAMETRIC INFO
P89LPC931FDH PACKAGE INFO
P89LPC931FDH MANUFACTURING INFO
P89LPC931FDH PACKAGING INFO


COUNTRY OF ORIGIN
China
Philippines
Thailand


PARAMETRIC INFO
Family Name 89LP
Data Bus Width (bit) 8
Device Core 80C51
Instruction Set Architecture CISC
Maximum Clock Rate (MHz) 18
Program Memory Type Flash
Program Memory Size 8KB
RAM Size 256B
Maximum Expanded Memory Size 64KB
Maximum CPU Frequency (MHz) 18
GPIO 26
Number of Timers 2
Core Architecture 8051
PWM 1
Watchdog 1
Analog Comparators 2
Interface Type I2C/SPI/UART
Programmability Yes
Maximum Power Dissipation (mW) 1500
Minimum Operating Supply Voltage (V) 2.4
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 28
Lead Shape Gull-wing
PCB 28
Tab N/R
Package Length (mm) 9.8(Max)
Package Width (mm) 4.5(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153AE
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Shelf Life Condition N/A


PACKAGING INFO
Packaging Document Link to Datasheet
Продукт RFQ