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| CATALOG |
PAM2305CGFADJ COUNTRY OF ORIGIN
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PAM2305CGFADJ PARAMETRIC INFO
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PAM2305CGFADJ PACKAGE INFO
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PAM2305CGFADJ MANUFACTURING INFO
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PAM2305CGFADJ PACKAGING INFO
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PAM2305CGFADJ ECAD MODELS
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COUNTRY OF ORIGIN
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China
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PARAMETRIC INFO
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| Type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
2.5 |
| Maximum Input Voltage (V) |
5.5 |
| Output Voltage (V) |
0.6 to 5.5 |
| Maximum Output Current (A) |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Switching Frequency (kHz) |
1800 |
| Efficiency (%) |
96(Typ) |
| Switching Regulator |
Yes |
| Operating Supply Voltage Range (V) |
2.5 to 5.5 |
| Output Type |
Adjustable |
| Load Regulation |
1.5% |
| Line Regulation |
0.5%/V |
| Typical Quiescent Current (uA) |
40 |
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PACKAGE INFO
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| Supplier Package |
UDFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
No Lead |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2 |
| Package Width (mm) |
2 |
| Package Height (mm) |
0.57 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.6 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Dual Flat Package No Lead, Exposed Pad |
| Package Family Name |
DFN |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
300 |
| Wave Solder Time (Sec) |
5 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
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ECAD MODELS
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