PCA82C250T/YM,118 NXP Semiconductors IC TXRX CAN INTERFACE 8SOIC

label:
2024/03/21 258



• Fully compatible with the “ISO 11898” standard
• High speed (up to 1 MBd)
• Bus lines protected against transients in an automotive environment
• Slope control to reduce Radio Frequency Interference (RFI)
• Differential receiver with wide common-mode range for high immunity againstElectroMagnetic Interference (EMI)
• Thermally protected
• Short-circuit proof to battery and ground
• Low-current Standby mode
• An unpowered node does not disturb the bus lines
• At least 110 nodes can be connected


CATALOG
PCA82C250T/YM,118 COUNTRY OF ORIGIN
PCA82C250T/YM,118 PARAMETRIC INFO
PCA82C250T/YM,118 PACKAGE INFO
PCA82C250T/YM,118 MANUFACTURING INFO
PCA82C250T/YM,118 PACKAGING INFO
PCA82C250T/YM,118 FUNCTIONAL BLOCK DIAGRAM
PCA82C250T/YM,118 APPLICATIONS


COUNTRY OF ORIGIN
Thailand
Taiwan (Province of China)
China


PARAMETRIC INFO
Category Transceiver
Maximum Data Rate 1MBd
Standard Supported ISO 11898
Number of Transceivers 1
Power Down Mode Standby
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Automotive
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -55
Typical Operating Supply Voltage (V) 5
Minimum Operating Supply Voltage (V) 4.5
Maximum Operating Supply Voltage (V) 5.5
Maximum Supply Current (mA) 70


PACKAGE INFO
Supplier Package SO
Pin Count 8
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.45(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Material Plastic
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material PdNiAg
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tape and Reel


FUNCTIONAL BLOCK DIAGRAM



APPLICATIONS
• High-speed automotive applications (up to 1 MBd).


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