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• Fully compatible with the “ISO 11898” standard
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• High speed (up to 1 MBd)
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• Bus lines protected against transients in an automotive environment
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• Slope control to reduce Radio Frequency Interference (RFI)
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• Differential receiver with wide common-mode range for high immunity againstElectroMagnetic Interference (EMI)
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• Thermally protected
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• Short-circuit proof to battery and ground
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• Low-current Standby mode
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• An unpowered node does not disturb the bus lines
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• At least 110 nodes can be connected
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CATALOG |
PCA82C250T/YM,118 COUNTRY OF ORIGIN
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PCA82C250T/YM,118 PARAMETRIC INFO
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PCA82C250T/YM,118 PACKAGE INFO
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PCA82C250T/YM,118 MANUFACTURING INFO
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PCA82C250T/YM,118 PACKAGING INFO
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PCA82C250T/YM,118 FUNCTIONAL BLOCK DIAGRAM
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PCA82C250T/YM,118 APPLICATIONS
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COUNTRY OF ORIGIN
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Thailand
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Taiwan (Province of China)
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China
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PARAMETRIC INFO
|
Category |
Transceiver |
Maximum Data Rate |
1MBd |
Standard Supported |
ISO 11898 |
Number of Transceivers |
1 |
Power Down Mode |
Standby |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Supplier Temperature Grade |
Automotive |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-55 |
Typical Operating Supply Voltage (V) |
5 |
Minimum Operating Supply Voltage (V) |
4.5 |
Maximum Operating Supply Voltage (V) |
5.5 |
Maximum Supply Current (mA) |
70 |
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PACKAGE INFO
|
Supplier Package |
SO |
Pin Count |
8 |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.45(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
N/A |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
PdNiAg |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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FUNCTIONAL BLOCK DIAGRAM
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APPLICATIONS
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• High-speed automotive applications (up to 1 MBd).
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