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• 2-Bit bidirectional translator for SDA and SCL lines in mixed-mode I2C Applications
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• Provides bidirectional voltage translation with no direction pin
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• Low 3.5-Ω ON-state resistance between input and output ports provides less signal distortion
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• Open-drain I2C I/O ports (SCL1, SDA1, SCL2, and SDA2)
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• 5-V Tolerant I2C I/O ports to support mixed-mode signal operation
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• High-impedance SCL1, SDA1, SCL2, and SDA2 pins for EN = low
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| CATALOG |
PCA9306YZTR COUNTRY OF ORIGIN
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PCA9306YZTR PARAMETRIC INFO
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PCA9306YZTR PACKAGE INFO
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PCA9306YZTR MANUFACTURING INFO
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PCA9306YZTR PACKAGING INFO
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PCA9306YZTR ECAD MODELS
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PCA9306YZTR APPLICATIONS
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COUNTRY OF ORIGIN
|
Philippines
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PARAMETRIC INFO
|
| Number of Channels |
2 |
| Channel Type |
Bidirectional |
| Logic Function |
Voltage Level Translator |
| Output Type |
Open Drain|Push-Pull |
| Maximum Frequency (MHz) |
0.4 |
| Minimum Latch-Up Current (mA) |
100 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Supply Voltage (V) |
1.2/1.8 |
| Maximum Operating Supply Voltage (V) |
3.3/5.5 |
| Typical Operating Supply Voltage (V) |
1.8|1.8/2.5|1.8/3.3|1.8/5|2.5|2.5/3.3|2.5/5 |
| Maximum Propagation Delay Time @ Maximum CL (ns) |
1.4@1.8V@3.3V |
| Absolute Propagation Delay Time (ns) |
2.1 |
|
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PACKAGE INFO
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| Supplier Package |
DSBGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
8 |
| Lead Shape |
Ball |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
1.92(Max) |
| Package Width (mm) |
0.92(Max) |
| Package Height (mm) |
0.44(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.63(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Die Size Ball Grid Array |
| Package Family Name |
BGA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
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PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • I2C, SMBus, PMBus, MDIO, UART, low-speed SDIO, GPIO, and other two-signal interfaces |
| • Servers |
| • Routers (telecom switching equipment) |
| • Personal Computers |
| • Industrial Automation |
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