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• Low Standby-Current Consumption of 10 μA Max
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• I2C to Parallel-Port Expander
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• Open-Drain Interrupt Output
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• Compatible With Most Microcontrollers
|
• Latched Outputs With High-Current DriveCapability for Directly Driving LEDs
|
• Latch-Up Performance Exceeds 100 mAPer JESD 78, Class II
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|
| CATALOG |
PCF8574PWR COUNTRY OF ORIGIN
|
PCF8574PWR PARAMETRIC INFO
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PCF8574PWR PACKAGE INFO
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PCF8574PWR MANUFACTURING INFO
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PCF8574PWR PACKAGING INFO
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PCF8574PWR ECAD MODELS
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PCF8574PWR FUNCTIONAL BLOCK DIAGRAM
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PCF8574PWR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Philippines
|
Malaysia
|
Japan
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|
PARAMETRIC INFO
|
| Number of I/Os |
8 |
| Interface Type |
I2C |
| I2C Bus Interface Mode |
Standard Mode |
| Interface Speed (kHz) |
100 |
| Number of Addresses |
8 |
| Output Type |
Open Drain |
| Minimum Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
6 |
| Maximum Source Current per Bit (mA) |
-1 |
| Maximum Sink Current per Bit (mA) |
25 |
| Maximum Quiescent Current (uA) |
10 |
| Manual Reset |
No |
| Interrupt Output |
Yes |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
20 |
| Lead Shape |
Gull-wing |
| PCB |
20 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
6.6(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6.6(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AC |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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|
ECAD MODELS
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FUNCTIONAL BLOCK DIAGRAM
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APPLICATIONS
|
• Telecom Shelters: Filter Units
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• Servers
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• Routers (Telecom Switching Equipment)
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• Personal Computers
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• Personal Electronics
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• Industrial Automation
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• Products with GPIO-Limited Processors
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