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1• 24-Bit ΔΣ ADC and DAC
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• Flexible Mode Control:– Four-Wire SPI™, Two-Wire I 2C™ Compatible Serial Control Interface or Hardware Control
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• Multi Functions Through SPI or I2C I/F:– Audio I/F Mode and Format Select for ADC and DAC– Digital Attenuation and Soft Mute for ADC and DAC
– Digital De-Emphasis: 32, 44.1, and 48 kHz for DAC
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• Package: HTQFP-64
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| CATALOG |
PCM3168APAP COUNTRY OF ORIGIN
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PCM3168APAP PARAMETRIC INFO
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PCM3168APAP PACKAGE INFO
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PCM3168APAP MANUFACTURING INFO
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PCM3168APAP PACKAGING INFO
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PCM3168APAP ECAD MODELS
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PCM3168APAP APPLICATIONS
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COUNTRY OF ORIGIN
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Philippines
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Type |
General Purpose |
| ADC/DAC Resolution (bit) |
24 |
| Number of ADCs |
6 |
| Number of DACs |
8 |
| Interface Type |
Serial (I2C, SPI) |
| Sampling Rate (ksps) |
192 |
| Number of Channels |
6ADC / 8DAC |
| Number of ADC Inputs |
6 |
| Number of DAC Outputs |
8 |
| Maximum Power Dissipation (mW) |
1480 |
| Signal to Noise Ratio (dB) |
112 |
| Total Harmonic Distortion Plus Noise (THD+N) (dB) |
-94 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Analog|Digital |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Operating Supply Voltage (V) |
3.3|5 |
| Minimum Operating Supply Voltage (V) |
3|4.5 |
| Maximum Operating Supply Voltage (V) |
3.6|5.5 |
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PACKAGE INFO
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| Supplier Package |
HTQFP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
10.2(Max) |
| Package Width (mm) |
10.2(Max) |
| Package Height (mm) |
1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
12.2(Max) |
| Package Overall Width (mm) |
12.2(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Thin Quad Flat Package, Exposed Pad |
| Package Family Name |
QFP |
| Jedec |
MS-026 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
160 |
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ECAD MODELS
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| APPLICATIONS |
| • Car Audio External Amplifiers |
| • Car Audio AVN Applications |
| • Home Theaters |
| • AV Receivers |
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