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• Glass Passivated Die Construction
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• Low Leakage Current
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• High Forward Surge Current Capability
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• Lead Free Finish, RoHS Compliant (Note 1)
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• "Green" Molding Compound (No Br, Sb)
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| • Qualified to AEC-Q101 Standards for High Reliability
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|
| CATALOG |
PDR5G-13 COUNTRY OF ORIGIN
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PDR5G-13 PARAMETRIC INFO
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PDR5G-13 PACKAGE INFO
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PDR5G-13 MANUFACTURING INFO
|
PDR5G-13 PACKAGING INFO
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|
COUNTRY OF ORIGIN
|
| China |
| Taiwan (Province of China) |
|
PARAMETRIC INFO
|
| Type |
Switching Diode |
| Configuration |
Single Dual Anode |
| Peak Reverse Repetitive Voltage (V) |
400 |
| Maximum DC Reverse Voltage (V) |
400 |
| Maximum Continuous Forward Current (A) |
5 |
| Speed |
Standard Recovery Rectifier |
| Peak Forward Voltage (V) |
1.15 |
| Peak Non-Repetitive Surge Current (A) |
100 |
| Peak Reverse Current (uA) |
10 |
| Peak Reverse Recovery Time (ns) |
3000(Typ) |
| Operating Junction Temperature (°C) |
-65 to 150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
PowerDI 5 |
| Pin Count |
3 |
| PCB |
3 |
| Tab |
Tab |
| Package Length (mm) |
3.97 |
| Package Width (mm) |
5.37 |
| Package Height (mm) |
1.1(Max) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
|
|
PACKAGING INFO
|
| Packaging Suffix |
13 |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
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