PDZ5.6B-QX Nexperia TRANS PREBIAS NPN/PNP

label:
2025/12/9 14
PDZ5.6B-QX Nexperia TRANS PREBIAS NPN/PNP


• Total power dissipation: Ptot ≤ 400 mW
• Small plastic package suitable for surface mounted design
• Wide variety of voltage ranges: nominal 2.4 V to 36 V (E24 range)
• Tolerance approximately ± 2 %
• PDZ5.1B-Q - 10B-Q: Very low dynamic impedances at low currents, very low leakage current,hard breakdown knee
• Qualified according to AEC-Q101 and recommended for use in automotive applications


CATALOG
PDZ5.6B-QX COUNTRY OF ORIGIN
PDZ5.6B-QX PARAMETRIC INFO
PDZ5.6B-QX PACKAGE INFO
PDZ5.6B-QX MANUFACTURING INFO
PDZ5.6B-QX PACKAGING INFO
PDZ5.6B-QX APPLICATIONS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Type Voltage Regulator
Configuration Single
Typical Zener Voltage (V) 5.605
Maximum Reverse Leakage Current (uA) 1
Maximum Zener Impedance (Ohm) 50
Maximum Power Dissipation @ 25C (mW) 400
Maximum Power Dissipation (mW) 400
Typical Voltage Temperature Coefficient 1.9mV/K
Test Current (mA) 5
Maximum Zener Voltage (V) 5.73
Minimum Zener Voltage (V) 5.48
Zener Voltage Tolerance 2%
Minimum Operating Temperature (°C) -65
Maximum Operating Temperature (°C) 150
Supplier Temperature Grade Automotive


PACKAGE INFO
Supplier Package SOD-323
Basic Package Type Lead-Frame SMT
Pin Count 2
Lead Shape Gull-wing
PCB 2
Tab N/R
Pin Pitch (mm) N/R
Package Length (mm) 1.8(Max)
Package Width (mm) 1.35(Max)
Package Height (mm) 1.05(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Terminal Width (mm) 0.4(Max)
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Diode Package
Package Family Name SOD
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Lead Finish(Plating) Sn


PACKAGING INFO
Packaging Tape and Reel
Packaging Document Link to Datasheet


APPLICATIONS
• General voltage regulation
Продукт RFQ