 |
|
| • 0.25 pF (typ) Capacitance |
| • Low leakage current |
| • Low clamping voltage |
| • Fast response time (<1ns)
|
| • Capable of withstanding numerous ESD strikes |
| • Compatible with standard reflow installation procedures |
| • Thick film technology |
| • Bi-directional protection
|
|
| CATALOG |
| PESD0402-140 COUNTRY OF ORIGIN |
| PESD0402-140 PARAMETRIC INFO |
| PESD0402-140 PACKAGE INFO |
| PESD0402-140 MANUFACTURING INFO |
| PESD0402-140 PACKAGING INFO |
| PESD0402-140 ECAD MODELS |
| PESD0402-140 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
|
| PARAMETRIC INFO |
| Type |
Polymer |
| Direction Type |
Bi-Directional |
| Maximum Working Voltage (V) |
14 |
| Configuration |
Single |
| Capacitance Value (pF) |
0.25(Typ) |
| Maximum Clamping Voltage (V) |
40(Typ) |
| Maximum Leakage Current (uA) |
10 |
| Number of Elements per Chip |
1 |
| Maximum Response Time (ns) |
1 |
| Typical Trigger Voltage (V) |
250 |
| Minimum Operating Temperature (°C) |
-55 |
| Fail Safe Protection |
No |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
| Supplier Temperature Grade |
Automotive |
|
|
| PACKAGE INFO |
| Supplier Package |
Case 0402(1006Metric) |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
No Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/A |
| Package Length (mm) |
1.1(Max) |
| Package Width (mm) |
0.6(Max) |
| Package Height (mm) |
0.43(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.43(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
N/A |
| Package Description |
Surface Mount Device |
| Package Family Name |
SMD |
| Jedec |
N/A |
|
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
10000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
9 |
| Tape Pitch (mm) |
2 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • HDMI 1.3 interface |
| • LCD, HDTV |
| • Cellular phones |
| • Antennas (cell phones, GPS…) |
| • Portable video devices (PDA, DSC, Bluetooth…) |
| • Printer ports |
| • High speed Ethernet |
| • USB 2.0 and IEEE 1394 interfaces |
| • DVI interface
|
| |
|
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