 |
|
● DIGITALLY PROGRAMMABLE GAIN:
- PGA204: G=1, 10, 100, 1000V/V
- PGA205: G=1, 2, 4, 8V/V |
| ● LOW OFFSET VOLTAGE: 50µV max |
| ● LOW OFFSET VOLTAGE DRIFT: 0.25µV/°C |
| ● LOW INPUT BIAS CURRENT: 2nA max |
| ● LOW QUIESCENT CURRENT: 5.2mA typ |
| ● NO LOGIC SUPPLY REQUIRED |
| ● 16-PIN PLASTIC DIP, SOL-16 PACKAGES |
|
| CATALOG |
| PGA204AU/1K COUNTRY OF ORIGIN |
| PGA204AU/1K PARAMETRIC INFO |
| PGA204AU/1K PACKAGE INFO |
| PGA204AU/1K MANUFACTURING INFO |
| PGA204AU/1K PACKAGING INFO |
| PGA204AU/1K ECAD MODELS |
| PGA204AU/1K APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Philippines |
| Taiwan (Province of China) |
| Thailand |
| Malaysia |
|
| PARAMETRIC INFO |
| Number of Channels per Chip |
1 |
| Maximum Input Bias Current (uA) |
0.005@±15V |
| Minimum CMRR (dB) |
75 |
| Maximum Quiescent Current (mA) |
7.5@±15V |
| Minimum CMRR Range (dB) |
75 to 85 |
| Minimum Dual Supply Voltage (V) |
±4.5 |
| Maximum Input Resistance (MOhm) |
10000(Typ)@±15V |
| Maximum Dual Supply Voltage (V) |
±18 |
| Maximum Voltage Gain Range (dB) |
60 to 75 |
| Maximum Voltage Gain (dB) |
60 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Power Supply Type |
Dual |
| Maximum Supply Voltage Range (V) |
30 to 50 |
| Typical Dual Supply Voltage (V) |
±15 |
| Maximum Operating Supply Voltage (V) |
±18 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
10.5(Max) |
| Package Width (mm) |
7.6(Max) |
| Package Height (mm) |
2.35(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.5(Max) |
| Package Overall Width (mm) |
10.63(Max) |
| Package Overall Height (mm) |
2.65(Max) |
| Seated Plane Height (mm) |
2.65(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-013AA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
1K |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| ● DATA ACQUISITION SYSTEM |
| ● GENERAL PURPOSE ANALOG BOARDS |
| ● MEDICAL INSTRUMENTATION |
| |
| |
One-stop supplier of IC products