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• Complete Bridge Sensor Conditioner
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• Voltage Output: Ratiometric or Absolute
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• Digital Cal: No Potentiometers/Sensor Trims
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| • Sensor Error Compensation– Span, Offset, and Temperature Drifts |
| • Low Error, Time-Stable |
| • Sensor Linearization Circuitry |
| • Temperature Sense: Internal or External |
| • Calibration Lookup Table Logic– Uses External EEPROM (SOT23-5) |
| • Over/Under-Scale Limiting |
| • Sensor Fault Detection |
| • +2.7V TO +5.5V Operation |
| • –40°C to +125°C Operation |
| • Small TSSOP-16 Package |
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| CATALOG |
| PGA309AIPWR COUNTRY OF ORIGIN |
PGA309AIPWR PARAMETRIC INFO
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PGA309AIPWR PACKAGE INFO
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PGA309AIPWR MANUFACTURING INFO
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PGA309AIPWR PACKAGING INFO
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PGA309AIPWR EACD MODELS
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| PGA309AIPWR APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Malaysia |
| China |
| Taiwan (Province of China) |
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PARAMETRIC INFO
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| Sensor Type |
Sensor Conditioner |
| Input Type |
Analog |
| Output Type |
Analog |
| Interface Type |
Serial |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-60 |
| Maximum Storage Temperature (°C) |
150 |
| Temperature Flag |
Opr |
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PACKAGE INFO
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| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
Gull-wing |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AB |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Bridge Sensors |
| • Remote 4-20mA Transmitters |
| • Strain, Load, and Weigh Scales |
| • Automotive Sensors |
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