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• On-board RGB status LED (ext. drive provided)
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• 18 Mixed-signal GPIO and advanced peripherals
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• Open source design
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• Real-time operating system (FreeRTOS)
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• Soft AP setup
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• FCC, CE and IC certified
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| CATALOG |
PHOTONH PARAMETRIC INFO
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PHOTONH MANUFACTURING INFO
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PHOTONH PACKAGING INFO
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PARAMETRIC INFO
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| Tradename |
Photon |
| Type |
Development Board |
| Supported Device |
BCM43362 |
| Supported Device Technology |
Combo Wireless Module |
| Typical Operating Frequency (MHz) |
2462(Max)|2472(Max) |
| Typical Output Power (dBm) |
1.5 |
| Interface Type |
ADC/CAN/DAC/Digital I/O/I2C/I2S/PWM/SPI/USB |
| Minimum Operating Temperature (°C) |
-20 |
| Maximum Operating Temperature (°C) |
60 |
| Typical Operating Supply Voltage (V) |
3.6(Max)/5.5(Max) |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
85 |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Number of Reflow Cycle |
N/R |
| Standard |
N/R |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
N/R |
| Under Plating Material |
N/R |
| Terminal Base Material |
N/R |
| Number of Wave Cycles |
N/R |
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| PACKAGING INFO |
| Packaging |
Box |
| Packaging Document |
Link to Datasheet |
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