PIC16F18857-I/SS Microchip Technology IC MCU 8BIT 56KB FLASH 28SSOP

label:
2024/04/16 226


CATALOG
PIC16F18857-I/SS COUNTRY OF ORIGIN
PIC16F18857-I/SS PARAMETRIC INFO
PIC16F18857-I/SS PACKAGE INFO
PIC16F18857-I/SS MANUFACTURING INFO
PIC16F18857-I/SS PACKAGING INFO
PIC16F18857-I/SS EACD MODELS


COUNTRY OF ORIGIN
Philippines
Taiwan (Province of China)
Malaysia
Thailand
PARAMETRIC INFO
Series name PIC16
Data Bus Width (bit) 8
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 32
Program Memory Type Flash
Program Memory Size 56KB
RAM Size 4KB
Maximum CPU Frequency (MHz) 32
Number of Programmable I/Os 25
Number of Timers 7
ADC Channels twenty four
DAC Channels 1
ADC Resolution (bit) 10
Core Architecture PIC
Number of ADCs Single
Number of DACs Single
DAC Resolution (bit) 5
Interface Type I2C/SPI/USART
Programmability yes
SPI 2
I2C 2
I2S 0
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Rating Industrial
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier packaging SSOP
Basic package type Lead-Frame SMT
Number of pins 28
Pin shape Gull-wing
PCB 28
ears N/R
Pin spacing (mm) 0.65
Package length (mm) 10.2
Package width (mm) 5.3
Package height (mm) 1.75
Package diameter (mm) N/R
Mounting surface height (mm) 2(Max)
Install Surface Mount
Packaging materials Plastic
package instruction Shrink Small Outline Package
Package series name SO
JEDEC MO-150AH
Package outline Link to datasheet


MANUFACTURING INFO
Lead Finish(Plating) Matte Sn annealed


PACKAGING INFO
Package Tube
Packing quantity 47


ECAD MODELS

Продукт RFQ