PIC16F628A-I/P Microchip Technology IC MCU 8BIT 3.5KB FLASH 18DIP

label:
2024/08/29 208
PIC16F628A-I/P Microchip Technology IC MCU 8BIT 3.5KB FLASH 18DIP


CATALOG
PIC16F628A-I/P COUNTRY OF ORIGIN
PIC16F628A-I/P PARAMETRIC INFO
PIC16F628A-I/P PACKAGE INFO
PIC16F628A-I/P MANUFACTURING INFO
PIC16F628A-I/P PACKAGING INFO
PIC16F628A-I/P ECAD MODELS


COUNTRY OF ORIGIN
Thailand


PARAMETRIC INFO
Family Name PIC16
Data Bus Width (bit) 8
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 20
Program Memory Type Flash
Program Memory Size 3.5KB
RAM Size 224B
Maximum Expanded Memory Size 64KB
Power On Reset No
Memory Protection Unit No
Temperature Sensor No
DDR No
Memory Management Unit No
Integrated Development Environment Yes
Super Scalar No
External Bus Interface No
EEPROM 128B
Direct Memory Access No
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Maximum CPU Frequency (MHz) 20
Number of Programmable I/Os 16
Number of Timers 3
Core Architecture PIC
PWM 1
Watchdog 1
Analog Comparators 2
Interface Type SCI/USART
Programmability Yes
SPI 0
I2C 0
Process Technology CMOS
I2S 0
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 800
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package PDIP
Basic Package Type Through Hole
Pin Count 18
Lead Shape Through Hole
PCB 18
Tab N/R
Package Length (mm) 22.86
Package Width (mm) 6.35
Package Height (mm) 3.3
Package Diameter (mm) N/R
Mounting Through Hole
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 25


ECAD MODELS


Продукт RFQ