PIC16F628A-I/SO Microchip Technology IC MCU 8BIT 3.5KB FLASH 18SOIC

label:
2024/04/22 290

CATALOG
PIC16F628A-I/SO COUNTRY OF ORIGIN
PIC16F628A-I/SO PARAMETRIC INFO
PIC16F628A-I/SO PACKAGE INFO
PIC16F628A-I/SO MANUFACTURING INFO
PIC16F628A-I/SO PACKAGING INFO
PIC16F628A-I/SO EACD MODELS



COUNTRY OF ORIGIN
China
Thailand



PARAMETRIC INFO
Family Name PIC16
Data Bus Width (bit) 8
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 20
Program Memory Type Flash
Program Memory Size 3.5KB
RAM Size 224B
Maximum Expanded Memory Size 64KB
Maximum CPU Frequency (MHz) 20
EEPROM 128B
Direct Memory Access No
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit No
Temperature Sensor No
DDR No
Memory Management Unit No
Integrated Development Environment Yes
Super Scalar No
External Bus Interface No
Number of Programmable I/Os 16
Number of Timers 3
Core Architecture PIC
PWM 1
Watchdog 1
Analog Comparators 2
Interface Type SCI/USART
Programmability Yes
SPI 0
I2C 0
I2S 0
Process Technology CMOS
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 800
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65



PACKAGE INFO
Supplier Package SOIC W
Basic Package Type Lead-Frame SMT
Pin Count 18
Lead Shape Gull-wing
PCB 18
Tab N/R
Package Length (mm) 11.55
Package Width (mm) 7.5
Package Height (mm) 2.05(Min)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Small Outline IC Wide Body
Package Family Name SO
Jedec MS-013AB
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Tube
Quantity Of Packaging 42



ECAD MODELS




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