 |
|
• Standby Current:
- 50 nA @ 2.0V, typical |
• Operating Current:
- 11 μA @ 32 kHz, 2.0V, typical
- 220 μA @ 4 MHz, 2.0V, typical
|
• Watchdog Timer Current:
- 1 μA @ 2.0V, typical |
|
| CATALOG |
| PIC16F684T-I/SL COUNTRY OF ORIGIN |
| PIC16F684T-I/SL PARAMETRIC INFO |
| PIC16F684T-I/SL PACKAGE INFO |
| PIC16F684T-I/SL MANUFACTURING INFO |
| PIC16F684T-I/SL PACKAGING INFO |
| PIC16F684T-I/SL ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| Thailand |
|
| PARAMETRIC INFO |
| Data Bus Width (bit) |
8 |
| Family Name |
PIC16 |
| Device Core |
PIC |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
20 |
| Program Memory Type |
Flash |
| Program Memory Size |
3.5KB |
| RAM Size |
128B |
| Maximum CPU Frequency (MHz) |
20 |
| Number of Programmable I/Os |
12 |
| Number of Timers |
3 |
| ADC Channels |
8 |
| ADC Resolution (bit) |
10 |
| Core Architecture |
PIC |
| Number of ADCs |
Single |
| PWM |
1 |
| Watchdog |
1 |
| Analog Comparators |
2 |
| Programmability |
Yes |
| SPI |
0 |
| I2C |
0 |
| I2S |
0 |
| UART |
0 |
| USART |
0 |
| CAN |
0 |
| USB |
0 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
800 |
| Minimum Operating Supply Voltage (V) |
2 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3|5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
14 |
| Lead Shape |
Gull-wing |
| PCB |
14 |
| Tab |
N/R |
| Package Length (mm) |
8.65 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.25(Min) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AB |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2600 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
| |
| ECAD MODELS |
 |
|
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