PIC16F690T-I/SS Microchip Technology IC MCU 8BIT 7KB FLASH 20SSOP

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2024/10/15 203
                                 
PIC16F690T-I/SS Microchip Technology IC MCU 8BIT 7KB FLASH 20SSOP


CATALOG
PIC16F690T-I/SS COUNTRY OF ORIGIN
PIC16F690T-I/SS PARAMETRIC INFO
PIC16F690T-I/SS PACKAGE INFO
PIC16F690T-I/SS MANUFACTURING INFO
PIC16F690T-I/SS PACKAGING INFO
PIC16F690T-I/SS ECAD MODELS


COUNTRY OF ORIGIN
Philippines
Thailand


PARAMETRIC INFO
Family Name PIC16
Data Bus Width (bit) 8
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 20
Program Memory Type Flash
Program Memory Size 7KB
RAM Size 256B
Maximum Expanded Memory Size 14KB
Power On Reset No
Memory Protection Unit No
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment Yes
Super Scalar No
External Bus Interface No
EEPROM 256B
Direct Memory Access No
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Maximum CPU Frequency (MHz) 20
Number of Programmable I/Os 18
Number of Timers 3
ADC Channels 12
ADC Resolution (bit) 10
Core Architecture PIC
Number of ADCs Single
PWM 1
Watchdog 1
Analog Comparators 2
Parallel Master Port No
Real Time Clock No
Interface Type I2C/SPI/USART
Programmability Yes
SPI 1
I2C 1
I2S 0
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 800
Minimum Operating Supply Voltage (V) 4.5
Typical Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package SSOP
Basic Package Type Lead-Frame SMT
Pin Count 20
Lead Shape Gull-wing
PCB 20
Tab N/R
Package Length (mm) 7.2
Package Width (mm) 5.3
Package Height (mm) 1.75
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Shrink Small Outline Package
Package Family Name SO
Jedec MO-150AE
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 1600
Reel Diameter (in) 13
Tape Pitch (mm) 12
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Type Embossed


ECAD MODELS


Продукт RFQ