PIC16F721-I/SS Microchip Technology IC MCU 8BIT 7KB FLASH 20SSOP

label:
2023/11/9 235



CATALOG
PIC16F721-I/SS COUNTRY OF ORIGIN
PIC16F721-I/SS PARAMETRIC INFO
PIC16F721-I/SS PACKAGE INFO
PIC16F721-I/SS MANUFACTURING INFO
PIC16F721-I/SS PACKAGING INFO
PIC16F721-I/SS ECAD MODELS


COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Data Bus Width (bit) 8
Family Name PIC16
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 16
Program Memory Type Flash
Program Memory Size 7KB
RAM Size 256B
Maximum CPU Frequency (MHz) 16
Number of Programmable I/Os 17
Number of Timers 3
ADC Channels 12
ADC Resolution (bit) 8
Core Architecture PIC
Number of ADCs Single
PWM 1
Watchdog 1
Interface Type I2C/SPI/USART
Programmability Yes
SPI 1
I2C 1
I2S 0
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 800
Minimum Operating Supply Voltage (V) 1.8
Typical Operating Supply Voltage (V) 2.5|3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package SSOP
Basic Package Type Lead-Frame SMT
Pin Count 20
Lead Shape Gull-wing
PCB 20
Tab N/R
Package Length (mm) 7.2
Package Width (mm) 5.3
Package Height (mm) 1.75
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Shrink Small Outline Package
Package Family Name SO
Jedec MO-150AE
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 67


ECAD MODELS


Продукт RFQ