PIC16F870-I/SP Microchip Technology IC MCU 8BIT 3.5KB FLASH 28SDIP

label:
2024/07/31 222
PIC16F870-I/SP Microchip Technology 	IC MCU 8BIT 3.5KB FLASH 28SDIP


• High performance RISC CPU
• Only 35 single word instructions to learn
• All single cycle instructions except for program branches which are two-cycle
• Operating speed: DC - 20 MHz clock input DC - 200 ns instruction cycle
• Pinout compatible to the PIC16CXXX 28 and 40-pin devices
• Interrupt capability (up to 11 sources)
• Eight level deep hardware stack
• Direct, Indirect and Relative Addressing modes


CATALOG
PIC16F870-I/SP COUNTRY OF ORIGIN
PIC16F870-I/SP PARAMETRIC INFO
PIC16F870-I/SP PACKAGE INFO
PIC16F870-I/SP MANUFACTURING INFO
PIC16F870-I/SP PACKAGING INFO
PIC16F870-I/SP ECAD MODELS


COUNTRY OF ORIGIN
Malaysia
Taiwan (Province of China)
Singapore
Thailand
China


PARAMETRIC INFO
Family Name PIC16
Data Bus Width (bit) 8
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 20
Program Memory Type Flash
Program Memory Size 3.5KB
RAM Size 128B
Maximum CPU Frequency (MHz) 20
Number of Programmable I/Os 22
Number of Timers 3
ADC Channels 5
ADC Resolution (bit) 10
Core Architecture PIC
Number of ADCs Single
PWM 1
Watchdog 1
Interface Type USART
Programmability Yes
SPI 0
I2C 0
I2S 0
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 1000
Minimum Operating Supply Voltage (V) 4
Typical Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package SPDIP
Basic Package Type Through Hole
Pin Count 28
Lead Shape Through Hole
PCB 28
Tab N/R
Package Length (mm) 34.67
Package Width (mm) 7.24
Package Height (mm) 3.43
Package Diameter (mm) N/R
Mounting Through Hole
Package Weight (g) N/A
Package Material Plastic
Package Family Name DIP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 15


ECAD MODELS
Продукт RFQ