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• High performance RISC CPU
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• Only 35 single word instructions to learn
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• All single cycle instructions except for program branches which are two-cycle
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• Operating speed: DC - 20 MHz clock input DC - 200 ns instruction cycle
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• Pinout compatible to the PIC16CXXX 28 and 40-pin devices
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• Interrupt capability (up to 11 sources)
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• Eight level deep hardware stack
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• Direct, Indirect and Relative Addressing modes
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CATALOG |
PIC16F870-I/SP COUNTRY OF ORIGIN
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PIC16F870-I/SP PARAMETRIC INFO
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PIC16F870-I/SP PACKAGE INFO
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PIC16F870-I/SP MANUFACTURING INFO
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PIC16F870-I/SP PACKAGING INFO
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PIC16F870-I/SP ECAD MODELS
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COUNTRY OF ORIGIN
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Malaysia
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Taiwan (Province of China)
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Singapore
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Thailand
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China
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PARAMETRIC INFO
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Family Name |
PIC16 |
Data Bus Width (bit) |
8 |
Device Core |
PIC |
Instruction Set Architecture |
RISC |
Maximum Clock Rate (MHz) |
20 |
Program Memory Type |
Flash |
Program Memory Size |
3.5KB |
RAM Size |
128B |
Maximum CPU Frequency (MHz) |
20 |
Number of Programmable I/Os |
22 |
Number of Timers |
3 |
ADC Channels |
5 |
ADC Resolution (bit) |
10 |
Core Architecture |
PIC |
Number of ADCs |
Single |
PWM |
1 |
Watchdog |
1 |
Interface Type |
USART |
Programmability |
Yes |
SPI |
0 |
I2C |
0 |
I2S |
0 |
UART |
0 |
USART |
1 |
CAN |
0 |
USB |
0 |
Ethernet |
0 |
Maximum Power Dissipation (mW) |
1000 |
Minimum Operating Supply Voltage (V) |
4 |
Typical Operating Supply Voltage (V) |
5 |
Maximum Operating Supply Voltage (V) |
5.5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Temperature Flag |
Opr |
Supplier Temperature Grade |
Industrial |
Operating Supply Voltage (V) |
5 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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Supplier Package |
SPDIP |
Basic Package Type |
Through Hole |
Pin Count |
28 |
Lead Shape |
Through Hole |
PCB |
28 |
Tab |
N/R |
Package Length (mm) |
34.67 |
Package Width (mm) |
7.24 |
Package Height (mm) |
3.43 |
Package Diameter (mm) |
N/R |
Mounting |
Through Hole |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Family Name |
DIP |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/R |
Reflow Solder Time (Sec) |
N/R |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
N/A |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging |
Tube |
Quantity Of Packaging |
15 |
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ECAD MODELS |
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