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| CATALOG |
PIC16F887-E/PT COUNTRY OF ORIGIN
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PIC16F887-E/PT PARAMETRIC INFO
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PIC16F887-E/PT PACKAGE INFO
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PIC16F887-E/PT MANUFACTURING INFO
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PIC16F887-E/PT PACKAGING INFO
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PIC16F887-E/PT ECAD MODELS
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COUNTRY OF ORIGIN
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Philippines
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Thailand
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| China |
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PARAMETRIC INFO
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| Type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
2.05 |
| Maximum Input Voltage (V) |
6 |
| Output Voltage (V) |
2.1 |
| Maximum Output Current (A) |
0.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Switching Frequency (kHz) |
3000(Typ) |
| Efficiency (%) |
94 |
| Switching Regulator |
Yes |
| Operating Supply Voltage Range (V) |
2.05 to 6 |
| Output Type |
Fixed |
| Load Regulation |
0.001%/mA(Typ) |
| Line Regulation |
0%/V(Typ) |
| Typical Quiescent Current (uA) |
22 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
0.85 |
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PACKAGE INFO
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| Supplier Package |
USON |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
No Lead |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
1.5(Max) |
| Package Width (mm) |
1.05(Max) |
| Package Height (mm) |
0.55(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
1.5(Max) |
| Package Overall Width (mm) |
1.05(Max) |
| Package Overall Height (mm) |
0.6(Max) |
| Seated Plane Height (mm) |
0.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline No Lead Package |
| Package Family Name |
SON |
| Jedec |
MO-287UFAD |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
AuAg |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
N/A|Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
5000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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