PIC18F25K22-I/SS Microchip Technology IC MCU 8BIT 32KB FLASH 28SSOP

label:
2024/04/7 206


CATALOG
PIC18F25K22-I/SS COUNTRY OF ORIGIN
PIC18F25K22-I/SS PARAMETRIC INFO
PIC18F25K22-I/SS PACKAGE INFO
PIC18F25K22-I/SS MANUFACTURING INFO
PIC18F25K22-I/SS PACKAGING INFO
PIC18F25K22-I/SS EACD MODELS


COUNTRY OF ORIGIN
Thailand
Taiwan (Province of China)
Philippines
China
Malaysia



PARAMETRIC INFO
Series name PIC18
Data Bus Width (bit) 8
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 64
Program Memory Type Flash
Program Memory Size 32KB
RAM Size 1.5KB
Maximum Expanded Memory Size 2MB
Maximum CPU Frequency (MHz) 64
Floating Point Unit no
Bluetooth no
Wi-Fi no
External Bus Interface no
Multiply Accumulate no
Internal/External Clock Type Internal/External
Touch Sensing Interface yes
Power On Reset yes
Memory Protection Unit no
Temperature Sensor no
DDR no
Memory Management Unit no
Integrated Development Environment no
Super Scalar no
EEPROM 256B
Direct Memory Access no
Number of Programmable I/Os 25
Number of Timers 7
ADC Channels 19
ADC Resolution (bit) 10
Core Architecture PIC
Number of ADCs Single
PWM 2
Watchdog 1
Analog Comparators 2
Parallel Master Port no
Real Time Clock no
Interface Type I2C/SPI/USART
Timers Resolution (bit) 8/8/8
Programmability yes
SPI 2
I2C 2
I2S 0
UART 0
USART 2
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 1000
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5|3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Rating Industrial
Operating Supply Voltage (V) 2.5|3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier packaging SSOP
Basic package type Lead-Frame SMT
Number of pins 28
Pin shape Gull-wing
PCB 28
ears N/R
Package length (mm) 10.2
Package width (mm) 5.3
Package height (mm) 1.75
Package diameter (mm) N/R
Install Surface Mount
package instruction Shrink Small Outline Package
Package series name SO
JEDEC MO-150AH
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 20 to 40
Number of reflow cycles 3
standard J-STD-020C
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material Cu Alloy


PACKAGING INFO
Package Tube
Packing quantity 47


ECAD MODELS

Продукт RFQ