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|
| • C Compiler Optimized RISC Architecture
|
• Operating Speed:
– DC – 64 MHz clock input over the full VDD range
– 62.5 ns minimum instruction cycle |
| • Programmable 2-Level Interrupt Priority |
| • 31-Level Deep Hardware Stack |
| • Three 8-Bit Timers (TMR2/4/6) with Hardware Limit Timer (HLT) |
| • Four 16-Bit Timers (TMR0/1/3/5) |
| • Low-Current Power-on Reset (POR) |
| • Power-up Timer (PWRT) |
| • Brown-out Reset (BOR)
|
| • Low-Power BOR (LPBOR) Option |
• Windowed Watchdog Timer (WWDT):
– Watchdog Reset on too long or too short interval between watchdog clear events
– Variable prescaler selection
– Variable window size selection
– All sources configurable in hardware or software |
|
| CATALOG |
| PIC18F26K40-I/SS COUNTRY OF ORIGIN |
| PIC18F26K40-I/SS PARAMETRIC INFO |
| PIC18F26K40-I/SS PACKAGE INFO |
| PIC18F26K40-I/SS MANUFACTURING INFO |
| PIC18F26K40-I/SS PACKAGING INFO |
| PIC18F26K40-I/SS ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| Thailand |
|
| PARAMETRIC INFO |
| Data Bus Width (bit) |
8 |
| Family Name |
PIC18 |
| Device Core |
PIC |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
64 |
| Program Memory Type |
Flash |
| Program Memory Size |
64KB |
| RAM Size |
3728B |
| Maximum CPU Frequency (MHz) |
64 |
| Number of Programmable I/Os |
25 |
| Number of Timers |
4 |
| ADC Channels |
24 |
| ADC Resolution (bit) |
10 |
| DAC Channels |
1 |
| Core Architecture |
PIC |
| Number of ADCs |
Single |
| DAC Resolution (bit) |
5 |
| Number of DACs |
Single |
| Interface Type |
I2C/SPI/USART |
| Programmability |
Yes |
| SPI |
2 |
| I2C |
2 |
| I2S |
0 |
| UART |
0 |
| USART |
2 |
| CAN |
0 |
| USB |
0 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
2.3 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3|5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
Gull-wing |
| PCB |
28 |
| Tab |
N/R |
| Package Length (mm) |
10.2 |
| Package Width (mm) |
5.3 |
| Package Height (mm) |
1.75 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-150AH |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging |
Tube |
| Quantity Of Packaging |
47 |
|
| |
| ECAD MODELS |
 |
|
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