PIC18F452-I/L Microchip Technology IC MCU 8BIT 32KB FLASH 44PLCC

label:
2024/04/24 270


CATALOG
PIC18F452-I/L COUNTRY OF ORIGIN
PIC18F452-I/L PARAMETRIC INFO
PIC18F452-I/L PACKAGE INFO
PIC18F452-I/L MANUFACTURING INFO
PIC18F452-I/L PACKAGING INFO
PIC18F452-I/L EACD MODELS


 
COUNTRY OF ORIGIN
Malaysia
Thailand


 
PARAMETRIC INFO
Family Name PIC18
Data Bus Width (bit) 8
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 40
Program Memory Type Flash
Program Memory Size 32KB
RAM Size 1.5KB
Maximum Expanded Memory Size 2MB
Maximum CPU Frequency (MHz) 40
EEPROM 256B
Direct Memory Access No
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit No
Temperature Sensor No
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Number of Programmable I/Os 34
Number of Timers 4
ADC Channels 8
ADC Resolution (bit) 10
Core Architecture PIC
Number of ADCs Single
PWM 2
Watchdog 1
Parallel Master Port No
Real Time Clock No
Interface Type I2C/SPI/USART
Programmability Yes
SPI 1
I2C 1
I2S 0
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 1000
Minimum Operating Supply Voltage (V) 4.2
Typical Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


 
PACKAGE INFO
Supplier Package PLCC
Basic Package Type Lead-Frame SMT
Pin Count 44
Lead Shape J-Lead
PCB 44
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 16.59
Package Width (mm) 16.59
Package Height (mm) 3.87
Package Diameter (mm) N/R
Seated Plane Height (mm) 4.37
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Leaded Chip Carrier
Package Family Name LCC
Jedec N/A


 
MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 245
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 27


 
ECAD MODELS




Продукт RFQ