PIC18F4550-I/P Microchip Technology IC MCU 8BIT 32KB FLASH 40DIP

label:
2024/01/26 201



CATALOG
PIC18F4550-I/P COUNTRY OF ORIGIN
PIC18F4550-I/P PARAMETRIC INFO
PIC18F4550-I/P PACKAGE INFO
PIC18F4550-I/P MANUFACTURING INFO
PIC18F4550-I/P PACKAGING INFO
PIC18F4550-I/P ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)
Thailand


PARAMETRIC INFO
Data Bus Width (bit) 8
Family Name PIC18
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 48
Program Memory Type Flash
Program Memory Size 32KB
RAM Size 2KB
Maximum Expanded Memory Size 2MB
Maximum CPU Frequency (MHz) 48
EEPROM 256B
Direct Memory Access Yes
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Input Capture Channels 1
Output Compare Channels 1
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset Yes
Memory Protection Unit No
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Data Memory Size 2KB
Number of Programmable I/Os 35
Number of Timers 4
ADC Channels 13
ADC Resolution (bit) 10
Number of ADCs Single
Core Architecture PIC
PWM 2
Watchdog 1
Analog Comparators 2
Parallel Master Port No
Real Time Clock Yes
Interface Type I2C/SPI/USART/USB
Programmability Yes
SPI 1
I2C 1
I2S 0
UART 0
USART 1
CAN 0
USB 1
Ethernet 0
Maximum Power Dissipation (mW) 1000
Minimum Operating Supply Voltage (V) 4.2
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package PDIP
Basic Package Type Through Hole
Pin Count 40
Lead Shape Through Hole
PCB 40
Tab N/R
Package Length (mm) 53.21(Max)
Package Width (mm) 14.73(Max)
Package Height (mm) 4.95(Max)
Package Diameter (mm) N/R
Mounting Through Hole
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) N/A
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 10


ECAD MODELS


Продукт RFQ