PIC18F6527-I/PT Microchip Technology IC MCU 8BIT 48KB FLASH 64TQFP

label:
2024/02/26 207



CATALOG
PIC18F6527-I/PT COUNTRY OF ORIGIN
PIC18F6527-I/PT PARAMETRIC INFO
PIC18F6527-I/PT PACKAGE INFO
PIC18F6527-I/PT MANUFACTURING INFO
PIC18F6527-I/PT PACKAGING INFO
PIC18F6527-I/PT ECAD MODELS


COUNTRY OF ORIGIN
Malaysia
Korea (Republic of)
Taiwan (Province of China)
China
Philippines
Thailand


PARAMETRIC INFO
Data Bus Width (bit) 8
Series name PIC18
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 40
Program Memory Type Flash
Program Memory Size 48KB
RAM Size 3936B
Maximum Expanded Memory Size 2MB
Maximum CPU Frequency (MHz) 40
EEPROM 1KB
Direct Memory Access no
Floating Point Unit no
Bluetooth no
Wi-Fi no
Multiply Accumulate no
Internal/External Clock Type Internal/External
Touch Sensing Interface no
Power On Reset no
Memory Protection Unit no
Temperature Sensor yes
DDR no
Memory Management Unit no
Integrated Development Environment yes
Super Scalar no
External Bus Interface no
Number of Programmable I/Os 54
Number of Timers 5
ADC Channels 12
ADC Resolution (bit) 10
Number of ADCs Single
Core Architecture PIC
PWM 5
Watchdog 1
Analog Comparators 2
Parallel Master Port no
Real Time Clock yes
Interface Type I2C/SPI/USART
Programmability yes
SPI 2
I2C 2
I2S 0
UART 0
USART 2
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 1000
Minimum Operating Supply Voltage (V) 4.2
Typical Operating Supply Voltage (V) 5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Rating Industrial
Operating Supply Voltage (V) 5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier packaging TQFP
Basic package type Lead-Frame SMT
Number of pins 64
Pin shape Gull-wing
PCB 64
ears N/R
Package length (mm) 10
Package width (mm) 10
Package height (mm) 1
Package diameter (mm) N/R
Install Surface Mount
Packaging materials Plastic
package instruction Thin Quad Flat Package
Package series name QFP
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1|3
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 20 to 40
Number of reflow cycles 3
standard J-STD-020C
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material Cu Alloy


PACKAGING INFO
Package Tray
packaging type file Link to datasheet


ECAD MODELS



Продукт RFQ