 |
|
| • Conforms to CAN 2.0B Active Specification
|
• Three Operating modes:
- Legacy mode (full backward compatibility with
existing PIC18CXX8/FXX8 CAN modules)
- Enhanced mode
- FIFO mode or programmable TX/RX buffers |
| • Message Bit Rates up to 1 Mbps |
| • DeviceNet™ Data Byte Filter Support |
| • Six Programmable Receive/Transmit Buffers |
| • Three Dedicated Transmit Buffers with Prioritization |
| • Two Dedicated Receive Buffers |
|
| CATALOG |
| PIC18F66K80-I/PT COUNTRY OF ORIGIN |
| PIC18F66K80-I/PT PARAMETRIC INFO |
| PIC18F66K80-I/PT PACKAGE INFO |
| PIC18F66K80-I/PT MANUFACTURING INFO |
| PIC18F66K80-I/PT PACKAGING INFO |
| PIC18F66K80-I/PT ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| Thailand |
| United States of America |
|
| PARAMETRIC INFO |
| Data Bus Width (bit) |
8 |
| Family Name |
PIC18 |
| Device Core |
PIC |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
64 |
| Program Memory Type |
Flash |
| Program Memory Size |
64KB |
| RAM Size |
3648B |
| Maximum Expanded Memory Size |
2MB |
| CAN Type |
2.0B |
| EEPROM |
1KB |
| Direct Memory Access |
No |
| Floating Point Unit |
No |
| Bluetooth |
No |
| Wi-Fi |
No |
| Multiply Accumulate |
No |
| Internal/External Clock Type |
Internal/External |
| Touch Sensing Interface |
No |
| Power On Reset |
No |
| Memory Protection Unit |
No |
| Temperature Sensor |
No |
| DDR |
No |
| Memory Management Unit |
No |
| Integrated Development Environment |
Yes |
| Super Scalar |
No |
| External Bus Interface |
No |
| Maximum CPU Frequency (MHz) |
64 |
| Number of Programmable I/Os |
54 |
| Number of Timers |
5 |
| ADC Channels |
11 |
| ADC Resolution (bit) |
12 |
| Core Architecture |
PIC |
| Number of ADCs |
Single |
| PWM |
2 |
| Watchdog |
1 |
| Analog Comparators |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Special Features |
CAN Controller |
| Interface Type |
CAN/I2C/SPI/USART |
| Programmability |
Yes |
| SPI |
1 |
| I2C |
1 |
| Process Technology |
nanoWatt XLP |
| I2S |
0 |
| UART |
0 |
| USART |
2 |
| CAN |
1 |
| USB |
0 |
| Ethernet |
0 |
| Maximum Power Dissipation (mW) |
1000 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Supplier Temperature Grade |
Industrial |
| Operating Supply Voltage (V) |
2.5|3.3|5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
| |
| PACKAGE INFO |
| Supplier Package |
TQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Package Length (mm) |
10 |
| Package Width (mm) |
10 |
| Package Height (mm) |
1 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thin Quad Flat Package |
| Package Family Name |
QFP |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1|3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging |
Tray |
| Quantity Of Packaging |
160 |
|
| |
| ECAD MODELS |
 |
|
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