PIC18F67K22-I/MRRSL Microchip Technology IC MCU 8BIT 128KB FLASH 64QFN

2025/05/20 7

• Two-Speed Oscillator Start-up

• Fail-Safe Clock Monitor

• Power-Saving Peripheral Module Disable (PMD)

• Ultra Low-Power Wake-up

• Fast Wake-up, 1 s Typical

CATALOG

Thailand

Family Name	PIC18
Data Bus Width (bit)	8
Device Core	PIC
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	64
Program Memory Type	Flash
Program Memory Size	128KB
RAM Size	4KB
Maximum Expanded Memory Size	2MB
Maximum CPU Frequency (MHz)	64
GPIO	53
Number of Timers	11
ADC Channels	16
ADC Resolution (bit)	12
Core Architecture	PIC
Number of ADCs	1
PWM	10
Watchdog	1
Analog Comparators	3
Interface Type	I2C/SPI/USART
Programmability	Yes
SPI	2
I2C	2
I2S	0
UART	0
USART	2
CAN	0
USB	0
Ethernet	0
Maximum Power Dissipation (mW)	1000
Minimum Operating Supply Voltage (V)	1.8
Typical Operating Supply Voltage (V)	2.5\|3.3\|5
Maximum Operating Supply Voltage (V)	3.6\|5.5
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Supplier Temperature Grade	Industrial
Operating Supply Voltage (V)	2.5\|3.3\|5
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

Supplier Package	QFN EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	64
Lead Shape	No Lead
PCB	64
Tab	N/R
Package Length (mm)	9
Package Width (mm)	9
Package Height (mm)	0.88
Package Diameter (mm)	N/R
Mounting	Surface Mount
Package Description	Quad Flat No Lead Package, Exposed Pad
Package Family Name	QFN
Package Outline	Link to Datasheet

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	20 to 40
Number of Reflow Cycle	3
Standard	J-STD-020C
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	Cu Alloy

Packaging	Tube
Quantity Of Packaging	40