PIC18LF2520T-I/SO Microchip Technology IC MCU 8BIT 32KB FLASH 28SOIC

label:
2024/03/7 196



CATALOG
PIC18LF2520T-I/SO COUNTRY OF ORIGIN
PIC18LF2520T-I/SO PARAMETRIC INFO
PIC18LF2520T-I/SO PACKAGE INFO
PIC18LF2520T-I/SO MANUFACTURING INFO
PIC18LF2520T-I/SO PACKAGING INFO
PIC18LF2520T-I/SO EACD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)
China
Thailand
Philippines


PARAMETRIC INFO
Data Bus Width (bit) 8
Series name PIC18
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 40
Program Memory Type Flash
Program Memory Size 32KB
RAM Size 1.5KB
Maximum Expanded Memory Size 2MB
Maximum CPU Frequency (MHz) 40
Direct Memory Access no
Floating Point Unit no
Bluetooth no
Wi-Fi no
Multiply Accumulate no
Internal/External Clock Type Internal/External
Touch Sensing Interface no
Power On Reset no
Memory Protection Unit no
Temperature Sensor no
DDR no
Memory Management Unit no
Integrated Development Environment no
Super Scalar no
External Bus Interface no
Number of Programmable I/Os 25
Number of Timers 4
ADC Channels 10
ADC Resolution (bit) 10
Number of ADCs Single
Core Architecture PIC
PWM 2
Watchdog 1
Analog Comparators 2
Interface Type I2C/SPI/USART
Programmability yes
SPI 1
I2C 1
I2S 0
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Maximum Power Dissipation (mW) 1000
Minimum Operating Supply Voltage (V) 2
Typical Operating Supply Voltage (V) 2.5|3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Rating Industrial
Operating Supply Voltage (V) 2.5|3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier packaging SOIC W
Basic package type Lead-Frame SMT
Number of pins 28
Pin shape Gull-wing
PCB 28
ears N/R
Package length (mm) 17.9
Package width (mm) 7.5
Package height (mm) 2.05(Min)
Package diameter (mm) N/R
Install Surface Mount
package instruction Small Outline IC Wide Body
Package series name SO
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1|3
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 20 to 40
Number of reflow cycles 3
standard J-STD-020C
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matte Sn annealed
Plating materials not applicable
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix T
Package Tape and reel packaging
Packing quantity 1600
Reel Diameter (in) 13
Tape Pitch (mm) 12
Tape Width (mm) twenty four
Component Orientation Q1
packaging type file Link to datasheet
Tape Type Embossed


ECAD MODELS

Продукт RFQ