PIC32MX110F016B-I/SS Microchip Technology IC MCU 32BIT 16KB FLASH 28SSOP

label:
2024/01/3 381


• Data communication: I2S, LJ, RJ, and DSP modes
• Control interface: SPI and I2C
• Master clock:
   - Generation of fractional clock frequencies
   - Can be synchronized with USB clock
   - Can be tuned in run-time


CATALOG
PIC32MX110F016B-I/SS COUNTRY OF ORIGIN
PIC32MX110F016B-I/SS PARAMETRIC INFO
PIC32MX110F016B-I/SS PACKAGE INFO
PIC32MX110F016B-I/SS MANUFACTURING INFO
PIC32MX110F016B-I/SS PACKAGING INFO  
PIC32MX110F016B-I/SS ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)
Thailand
Malaysia
Philippines


Parametric Info
Data Bus Width (bit) 32
Family Name PIC32
Device Core MIPS32 M4K
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 40
Program Memory Type Flash
Program Memory Size 16KB
RAM Size 4KB
Maximum Expanded Memory Size 4GB
Maximum CPU Frequency (MHz) 40
Trace Hardware JTAG
DMA Channels 4
Direct Memory Access Yes
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Input Capture Channels 5
Output Compare Channels 5
Internal/External Clock Type External
Touch Sensing Interface Yes
Power On Reset No
Memory Protection Unit No
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Number of Programmable I/Os 21
Number of Timers 5
ADC Channels 10
ADC Resolution (bit) 10
Number of ADCs Single
Core Architecture PIC
PWM 5
Watchdog 1
Analog Comparators 3
Parallel Master Port No
Real Time Clock Yes
Special Features LCD Controller
Interface Type I2C/I2S/SPI/UART
Programmability Yes
SPI 2
I2C 2
I2S 2
UART 2
USART 0
CAN 0
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
 


PACKAGE INFO
Supplier Package SSOP
Basic Package Type Lead-Frame SMT
Pin Count 28
Lead Shape Gull-wing
PCB 28
Tab N/R
Package Length (mm) 10.2
Package Width (mm) 5.3
Package Height (mm) 1.75
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Shrink Small Outline Package
Package Family Name SO
Jedec MO-150AH
Package Outline Link to Datasheet
 


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Tube
Quantity Of Packaging 47
 


ECAD MODELS

Продукт RFQ