PIC32MX570F512L-50I/PT Microchip Technology IC MCU 32BIT 512KB FLASH 100TQFP

label:
2023/08/31 511


 
• ADC Module:
   - 10-bit 1 Msps rate with one Sample and Hold (S&H)
   - Up to 48 analog inputs
   - Can operate during Sleep mode
• Flexible and independent ADC trigger sources
• On-chip temperature measurement capability
• Comparators:
   - Three dual-input Comparator modules
   - Programmable reference with 32 voltage points  


CATALOG
PIC32MX570F512L-50I/PT PARAMETRIC INFO
PIC32MX570F512L-50I/PT PACKAGE INFO
PIC32MX570F512L-50I/PT MANUFACTURING INFO
PIC32MX570F512L-50I/PT PACKAGING INFO


PARAMETRIC INFO
Data Bus Width (bit) 32
Family Name PIC32
Device Core MIPS32 M4K
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 50
Program Memory Type Flash
Program Memory Size 512KB
RAM Size 64KB
Maximum Expanded Memory Size 4GB
DMA Channels 8
Direct Memory Access Yes
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit No
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Maximum CPU Frequency (MHz) 50
Number of Programmable I/Os 81
Number of Timers 5
ADC Channels 48
ADC Resolution (bit) 10
Core Architecture PIC
Number of ADCs Single
PWM 1
Watchdog 1
Analog Comparators 3
Parallel Master Port No
Real Time Clock Yes
Special Features LCD Controller
Timers Resolution (bit) 16/16/16/16/16
Interface Type CAN/I2C/SPI/UART/USB
Programmability Yes
SPI 4
I2C 2
I2S 0
UART 5
USART 0
CAN 1
USB 1
Ethernet 0
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65
      

PACKAGE INFO
Supplier Package TQFP
Basic Package Type Lead-Frame SMT
Pin Count 100
Lead Shape Gull-wing
PCB 100
Tab N/R
Package Length (mm) 12
Package Width (mm) 12
Package Height (mm) 1
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Thin Quad Flat Package
Package Family Name QFP
Package Outline Link to Datasheet
 

MANUFACTURING INFO
MSL 1|3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
 

PACKAGING INFO
Packaging Tray
Packaging Document Link to Datasheet
 

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