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| CATALOG |
PN5180A0HN/C3E COUNTRY OF ORIGIN
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PN5180A0HN/C3E PARAMETRIC INFO
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PN5180A0HN/C3E PACKAGE INFO
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PN5180A0HN/C3E MANUFACTURING INFO
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PN5180A0HN/C3E PACKAGING INFO
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PN5180A0HN/C3E ECAD MODELS
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COUNTRY OF ORIGIN
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China
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Module/IC Classification |
IC |
| Operation |
Read/Write |
| Frequency Range (MHz) |
13.56(Typ) |
| Maximum Operating Supply Voltage (V) |
1.95|5.5 |
| Covered Range (mm) |
160 |
| Host Interface |
SPI |
| Maximum Data Rate (Kbps) |
848 |
| Minimum Operating Supply Voltage (V) |
1.65|2.7 |
| Typical Operating Supply Voltage (V) |
1.8|3.3 |
| Maximum Supply Current (mA) |
20|250 |
| Minimum Operating Temperature (°C) |
-30 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| RF Type |
NFC |
| NFC Forum Tags |
Types 1/2/3/4 |
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PACKAGE INFO
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| Supplier Package |
HVQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
40 |
| Lead Shape |
No Lead |
| PCB |
40 |
| Tab |
N/R |
| Package Length (mm) |
6 |
| Package Width (mm) |
6 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
490 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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