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• Includes NXP ISO/IEC14443-A and Innovatron ISO/IEC14443-B intellectual property licensing rights
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• Arm Cortex-M0 microcontroller core
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• Highly integrated demodulator and decoder
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| • Buffered output drivers to connect an antenna with minimum number of external components |
| • Integrated RF level detector |
| • Integrated Polling Loop for automatic device discovery |
| • RF protocols supported |
| • Supported host interfaces |
| • Integrated power management unit |
| • Automatic wake-up via RF field, internal timer and I2C-bus interface |
| • Integrated non-volatile memory to store data and executable code for customization |
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| CATALOG |
| PN7150B0HN/C11002Y COUNTRY OF ORIGIN |
PN7150B0HN/C11002Y PARAMETRIC INFO
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PN7150B0HN/C11002Y PACKAGE INFO
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PN7150B0HN/C11002Y MANUFACTURING INFO
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PN7150B0HN/C11002Y PACKAGING INFO
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| PN7150B0HN/C11002Y APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
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PARAMETRIC INFO
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| Module/IC Classification |
IC |
| Operation |
Read/Write |
| Frequency Range (MHz) |
13.56(Typ) |
| Maximum Operating Supply Voltage (V) |
1.95 |
| Covered Range (mm) |
160 |
| Host Interface |
I2C |
| Maximum Data Rate (Kbps) |
848 |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Typical Operating Supply Voltage (V) |
1.8 |
| Minimum Operating Temperature (°C) |
-30 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| RF Type |
NFC |
| Protocols Supported |
Felica|ISO/IEC 14443-A|ISO 14443-B|ISO/IEC 15693|ISO/IEC 18000-3|ISO/IEC 18092|MIFARE |
| NFC Forum Tags |
Type 5 |
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PACKAGE INFO
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| Supplier Package |
HVQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
40 |
| Lead Shape |
No Lead |
| PCB |
40 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
6 |
| Package Width (mm) |
6 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6 |
| Package Overall Width (mm) |
6 |
| Package Overall Height (mm) |
0.85 |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
4000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Feed Hole Pitch (mm) |
4 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
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| APPLICATIONS |
| • All devices requiring NFC functionality especially those running in an Android or Linux environment |
| • TVs, set-top boxes, blu-ray decoders, audio devices |
| • Home automation, gateways, wireless routers |
| • Home appliances |
| • Wearables, remote controls, healthcare, fitness |
| • Printers, IP phones, gaming consoles, accessories |
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