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• Input Voltage: 36 V to 75 V |
• 10-W Total Output Power |
• Output Voltages: 3.3 V, 5 V, and 12 V |
• Output Voltage Trim ±10% |
• Up To 87% Efficiency |
• Overcurrent Protection |
• Input Undervoltage Lockout |
• Output Overvoltage Protection |
• Positive or Negative Logic
Enable Control Option |
• Synchronization Option |
• Space-Saving, Industry Standard Footprint
(1.1 in x 1.0 in) / (27.94 mm × 24.38 mm) |
• Industry Standard Pinout |
• Surface Mount Package |
• 1500-Vdc Isolation |
• Agency Approvals:
- UL/IEC/CSA-C22.2 60950-1 |
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CATALOG |
PTMA402050A1AD COUNTRY OF ORIGIN |
PTMA402050A1AD PARAMETRIC INFO |
PTMA402050A1AD PACKAGE INFO |
PTMA402050A1AD MANUFACTURING INFO |
PTMA402050A1AD PACKAGING INFO |
PTMA402050A1AD ECAD MODELS |
PTMA402050A1AD APPLICATIONS |
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COUNTRY OF ORIGIN |
Mexico |
United States of America |
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PARAMETRIC INFO |
Isolation |
Isolated |
Type |
Step Down |
Number of Outputs |
1 |
Output Voltage (V) |
5 |
Maximum Output Power (W) |
10 |
Maximum Output Current (A) |
2 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Minimum Isolation Voltage |
1500VDC |
Switching Regulator |
Yes |
Minimum Input Voltage (V) |
36 |
Typical Input Voltage (V) |
48 |
Maximum Input Voltage (V) |
75 |
Output Type |
Fixed |
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PACKAGE INFO |
Supplier Package |
DIP Module |
Basic Package Type |
Through Hole |
Pin Count |
4 |
Lead Shape |
Through Hole |
PCB |
4 |
Tab |
N/R |
Package Length (mm) |
27.94 |
Package Width (mm) |
24.38 |
Package Height (mm) |
8.25 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
8.5(Max) |
Mounting |
Through Hole |
Package Description |
Dual In Line Module |
Package Family Name |
DIP |
Jedec |
N/A |
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MANUFACTURING INFO |
MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/R |
Reflow Solder Time (Sec) |
N/R |
Maximum Wave Temperature (°C) |
260 |
Wave Solder Time (Sec) |
20 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
N/A |
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PACKAGING INFO |
Packaging |
Tray |
Quantity Of Packaging |
30 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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APPLICATIONS |
• Intermediate Bus Architectures |
• Telecom, High-End Computing Platforms |
• Power Over Ethernet Applications |
• Multi-Rail Power Systems |
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