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| • Input Voltage: 36 V to 75 V |
| • 10-W Total Output Power |
| • Output Voltages: 3.3 V, 5 V, and 12 V |
| • Output Voltage Trim ±10% |
| • Up To 87% Efficiency |
| • Overcurrent Protection |
| • Input Undervoltage Lockout |
| • Output Overvoltage Protection |
| • Positive or Negative Logic
Enable Control Option |
| • Synchronization Option |
| • Space-Saving, Industry Standard Footprint
(1.1 in x 1.0 in) / (27.94 mm × 24.38 mm) |
| • Industry Standard Pinout |
| • Surface Mount Package |
| • 1500-Vdc Isolation |
• Agency Approvals:
- UL/IEC/CSA-C22.2 60950-1 |
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| CATALOG |
| PTMA402050A1AD COUNTRY OF ORIGIN |
| PTMA402050A1AD PARAMETRIC INFO |
| PTMA402050A1AD PACKAGE INFO |
| PTMA402050A1AD MANUFACTURING INFO |
| PTMA402050A1AD PACKAGING INFO |
| PTMA402050A1AD ECAD MODELS |
| PTMA402050A1AD APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Mexico |
| United States of America |
|
| PARAMETRIC INFO |
| Isolation |
Isolated |
| Type |
Step Down |
| Number of Outputs |
1 |
| Output Voltage (V) |
5 |
| Maximum Output Power (W) |
10 |
| Maximum Output Current (A) |
2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Isolation Voltage |
1500VDC |
| Switching Regulator |
Yes |
| Minimum Input Voltage (V) |
36 |
| Typical Input Voltage (V) |
48 |
| Maximum Input Voltage (V) |
75 |
| Output Type |
Fixed |
|
| |
| PACKAGE INFO |
| Supplier Package |
DIP Module |
| Basic Package Type |
Through Hole |
| Pin Count |
4 |
| Lead Shape |
Through Hole |
| PCB |
4 |
| Tab |
N/R |
| Package Length (mm) |
27.94 |
| Package Width (mm) |
24.38 |
| Package Height (mm) |
8.25 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
8.5(Max) |
| Mounting |
Through Hole |
| Package Description |
Dual In Line Module |
| Package Family Name |
DIP |
| Jedec |
N/A |
|
| |
| MANUFACTURING INFO |
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
20 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
| |
| PACKAGING INFO |
| Packaging |
Tray |
| Quantity Of Packaging |
30 |
| Packaging Document |
Link to Datasheet |
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| |
| ECAD MODELS |
|
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| APPLICATIONS |
| • Intermediate Bus Architectures |
| • Telecom, High-End Computing Platforms |
| • Power Over Ethernet Applications |
| • Multi-Rail Power Systems |
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