|
|
• Rated peak pulse power:PPPM = 400 W (350 W for 3V3)
|
• Reverse standoff voltage range: VRWM = 3.3 V to 64 V
|
• Reverse current: IRM = 0.001 μA
|
• Small plastic package suitable for surface-mounted design
|
|
| CATALOG |
PTVS36VS1UR,115 PARAMETRIC INFO
|
PTVS36VS1UR,115 PACKAGE INFO
|
PTVS36VS1UR,115 MANUFACTURING INFO
|
PTVS36VS1UR,115 PACKAGING INFO
|
PTVS36VS1UR,115 APPLICATIONS
|
|
PARAMETRIC INFO
|
| Configuration |
Single |
| Direction Type |
Uni-Directional |
| Maximum Reverse Stand-Off Voltage (V) |
36 |
| Minimum Breakdown Voltage (V) |
40 |
| Maximum Clamping Voltage (V) |
58.1 |
| Maximum Reverse Leakage Current (uA) |
0.1 |
| Number of Elements per Chip |
1 |
| Maximum Peak Pulse Current (A) |
6.9 |
| Test Current (mA) |
1 |
| Operating Junction Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Peak Pulse Power Dissipation (W) |
400 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
| Supplier Temperature Grade |
Automotive |
| Peak Forward Surge Current (A) |
50 |
|
|
PACKAGE INFO
|
| Supplier Package |
CFP3 |
| Pin Count |
2 |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
2.8(Max) |
| Package Width (mm) |
1.9(Max) |
| Package Height (mm) |
N/A |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
115 |
| Packaging |
Tape and Reel |
|
|
APPLICATIONS
|
• Power supply protection
|
• Automotive application
|
• Industrial application
|
• Power management
|
|
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