|
|
• Low insertion loss, 0.4 dB typ.
|
• High isolation, 19 dB typ.
|
• Wrap-around terminal for excellent solderability
|
• Ultra small, 0.12"X0.06"X0.035"
|
|
| CATALOG |
QCN-13D+ PARAMETER INFORMATION
|
QCN-13D+ PACKAGING INFORMATION
|
QCN-13D+ MANUFACTURING INFORMATION
|
QCN-13D+ PACKAGING INFORMATION
|
QCN-13D+ APPLICATIONS
|
|
PARAMETER INFORMATION
|
| Module/IC Classification |
IC |
| Number of Inputs |
1 |
| Number of Outputs |
2 |
| Frequency Range (MHz) |
675 to 1300 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
100 |
| Input Signal Type |
Single-Ended |
| Output Signal Type |
Single-Ended |
| Typical Input VSWR |
1.56 |
| Typical Output VSWR |
1.3 |
| Output Impedance (Ohm) |
50 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
100 |
| Category |
Passive |
| type |
Combiner/Splitter |
|
|
PACKAGING INFORMATION
|
| Supplier Packaging |
Case FV1206-1 |
| Number of Pins |
6 |
| PCB |
6 |
| Ear piece |
N/R |
| Pin spacing (mm) |
0.99 |
| Package length (mm) |
3.2 |
| Package width (mm) |
1.6 |
| Package height (mm) |
0.89 |
| Package diameter (mm) |
N/R |
| Mounting surface height (mm) |
0.89 |
| Install |
Surface Mount |
| Packaging materials |
Ceramic |
| Package Series Name |
not applicable |
| JEDEC |
not applicable |
| Package Outline |
Link to data sheet |
|
|
MANUFACTURING INFORMATION
|
| MSL |
not applicable |
| Maximum reflow temperature (°C) |
245 to 250 |
| Reflow time (seconds) |
not applicable |
| Reflow cycles |
not applicable |
| Reflow temperature source |
Link to data sheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Sn |
| Plating materials |
Ni |
| Terminal base material |
not applicable |
|
|
PACKAGING INFORMATION
|
| Package |
Tape and Reel Packaging |
| Package Type File |
Link to data sheet |
|
|
APPLICATIONS
|
• Balanced amplifiers
|
• Modulators
|
| • GSM |
| • Defense communication |
| • WiMax 700 |
| • GPS civilian |
| |
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