R5F56318DDFB#V0 Renesas Electronics IC MCU 32BIT 512KB FLASH 144QFP

label:
2025/07/11 10
R5F56318DDFB#V0 Renesas Electronics IC MCU 32BIT 512KB FLASH 144QFP


CATALOG
R5F56318DDFB#V0 COUNTRY OF ORIGIN
R5F56318DDFB#V0 PARAMETRIC INFO
R5F56318DDFB#V0 PACKAGE INFO
R5F56318DDFB#V0 MANUFACTURING INFO
R5F56318DDFB#V0 PACKAGING INFO
R5F56318DDFB#V0 ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Family Name RX
Data Bus Width (bit) 32
Device Core RX
Instruction Set Architecture CISC
Maximum Clock Rate (MHz) 100
Program Memory Type Flash
Program Memory Size 512KB
RAM Size 128KB
Maximum Expanded Memory Size 4GB
Maximum CPU Frequency (MHz) 100
Bluetooth No
Wi-Fi No
Data Memory Size 32KB
Memory Protection Unit No
DDR No
Memory Management Unit No
Integrated Development Environment No
External Bus Interface No
GPIO 111
Number of Timers 7
ADC Channels 8/21
DAC Channels 2
ADC Resolution (bit) 10/12
Core Architecture RX
Number of ADCs 2
Number of DACs 1
DAC Resolution (bit) 10
PWM 1
Watchdog 2
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Interface Type CAN/I2C/SCI/SPI/USB
Timers Resolution (bit) 8/16
Programmability Yes
SPI 3
I2C 4
I2S 0
UART 0
USART 0
CAN 2
USB 2
Ethernet 0
Maximum Power Dissipation (mW) 380
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Operating Supply Voltage (V) 3.3
Maximum Storage Temperature (°C) 125
Minimum Storage Temperature (°C) -55


PACKAGE INFO
Supplier Package LFQFP
Basic Package Type Lead-Frame SMT
Pin Count 144
Lead Shape Gull-wing
PCB 144
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 20
Package Width (mm) 20
Package Height (mm) 1.4
Package Diameter (mm) N/R
Package Overall Length (mm) 22
Package Overall Width (mm) 22
Package Overall Height (mm) 1.7(Max)
Seated Plane Height (mm) 1.7(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Low Profile Quad Flat Package
Package Family Name QFP
Jedec MS-026BFB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 250
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Sn|SnBi|SnCu
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix #V0
Packaging Tray


ECAD MODELS


Продукт RFQ