RB521S-30TE61 ROHM Semiconductor DIODE SCHOTTKY 30V 200MA EMD2

label:
2024/04/2 294



• Ultra small mold type.(EMD2)
• Low VF
• High reliability


CATALOG
RB521S-30TE61 COUNTRY OF ORIGIN
RB521S-30TE61 LIFE CYCLE
RB521S-30TE61 PARAMETRIC INFO
RB521S-30TE61 PACKAGE INFO
RB521S-30TE61 MANUFACTURING INFO
RB521S-30TE61 PACKAGING INFO
RB521S-30TE61 EACD MODELS
RB521S-30TE61 APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
Korea (Republic of)
Thailand
Philippines
Japan
China



LIFE CYCLE
ObsoleteApr 30,2020
PARAMETRIC INFO
type Schottky Diode
Configuration Single
Maximum DC Reverse Voltage (V) 30
Maximum Continuous Forward Current (A) 0.2
Peak Forward Voltage (V) 0.5
Peak Non-Repetitive Surge Current (A) 1
Peak Reverse Current (uA) 30
Operating Junction Temperature (°C) 125
Minimum Storage Temperature (°C) -40
Maximum Storage Temperature (°C) 125
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125


PACKAGE INFO
Supplier packaging EMD
Basic package type Lead-Frame SMT
Number of pins 2
Pin shape Flat
PCB 2
ears N/R
Pin spacing (mm) N/R
Package length (mm) 1.2
Package width (mm) 0.8
Package height (mm) 0.6
Package diameter (mm) N/R
Package Overall Length (mm) 1.6
Package Overall Width (mm) 0.8
Package Overall Height (mm) 0.6
Mounting surface height (mm) 0.6
Install Surface Mount
Package weight (g) not applicable
Package series name SOD
JEDEC not applicable


MANUFACTURING INFO
MSL 1
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) not applicable
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) 265
Wave soldering time (seconds) not applicable
Wave soldering temperature source Link to datasheet
Lead Finish(Plating) SnAgCu
Plating materials not applicable
Terminal Base Material Cu Alloy|FeNi Alloy


PACKAGING INFO
Package Tape and reel packaging
Packing quantity 3000
packaging type file Link to datasheet


ECAD MODELS



APPLICATIONS
• General rectification
Продукт RFQ