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● OUTPUT VOLTAGE: +5V ±0.2% max |
● EXCELLENT TEMPERATURE STABILITY:
10ppm/°C max (–40°C to +85°C) |
● LOW NOISE: 10µVPP max (0.1Hz to 10Hz) |
● EXCELLENT LINE REGULATION:
0.01%/V max |
● EXCELLENT LOAD REGULATION:
0.008%/mA max |
● LOW SUPPLY CURRENT: 1.4mA max |
● SHORT-CIRCUIT PROTECTED |
● WIDE SUPPLY RANGE: 8V to 40V |
● INDUSTRIAL TEMPERATURE RANGE:
–40°C to +85°C |
● PACKAGE OPTIONS: DIP-8, SO-8 |
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CATALOG |
REF02BU COUNTRY OF ORIGIN |
REF02BU PARAMETRIC INFO |
REF02BU PACKAGE INFO |
REF02BU MANUFACTURING INFO |
REF02BU PACKAGING INFO |
REF02BU ECAD MODELS |
REF02BU APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Thailand |
Malaysia |
Taiwan (Province of China) |
Philippines |
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PARAMETRIC INFO |
Topology |
Series |
Reference Type |
Precision |
Output Voltage (V) |
5 |
Initial Accuracy |
0.2% |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Supplier Temperature Grade |
Industrial |
Maximum Storage Temperature (°C) |
125 |
Minimum Storage Temperature (°C) |
-65 |
Load Regulation |
0.008%/mA |
Line Regulation |
0.01%/V |
Maximum Input Voltage (V) |
40 |
Regulation Condition Change In Load |
10mA |
Maximum Output Current (mA) |
21(Typ) |
Regulation Condition Change In Line |
25V |
Maximum Temperature Coefficient |
10ppm/°C |
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PACKAGE INFO |
Supplier Package |
SOIC |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
3.98(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.19(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Shelf Life Period |
5 Years |
Shelf Life Condition |
N/A |
Number of Wave Cycles |
N/R |
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PACKAGING INFO |
Packaging |
Tube |
Quantity Of Packaging |
75 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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APPLICATIONS |
● PRECISION REGULATORS |
● CONSTANT CURRENT SOURCE/SINK |
● DIGITAL VOLTMETERS |
● V/F CONVERTERS |
● A/D AND D/A CONVERTERS |
● PRECISION CALIBRATION STANDARD |
● TEST EQUIPMENT |
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