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• MicroSize Package: SOT23-3
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• Low Dropout: 5 mV
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• High Output Current: ±10 mA
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| • High Accuracy: 0.2% Maximum
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| • Low IQ: 115 µA Maximum |
| • Excellent Specified Drift Performance:– 15 ppm/°C (Maximum) from 0°C to +70°C– 20 ppm/°C (Maximum) from –40°C to +125°C |
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| CATALOG |
| REF3140AIDBZR COUNTRY OF ORIGIN |
REF3140AIDBZR PARAMETRIC INFO
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REF3140AIDBZR PACKAGE INFO
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REF3140AIDBZR MANUFACTURING INFO
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REF3140AIDBZR PACKAGING INFO
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| REF3140AIDBZR APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Malaysia |
| Philippines |
| Thailand |
| China |
|
PARAMETRIC INFO
|
| Topology |
Series |
| Reference Type |
Precision |
| Output Voltage (V) |
4.096 |
| Initial Accuracy |
0.2% |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Rating |
Industrial |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
| Load Regulation |
50uV/mA |
| Line Regulation |
65ppm/V |
| Maximum Input Voltage (V) |
7 |
| Regulation Condition Change In Load |
10mA |
| Maximum Output Current (mA) |
10 |
| Maximum Temperature Coefficient |
20ppm/°C |
| Process Technology |
CMOS |
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|
PACKAGE INFO
|
| Supplier packaging |
SOT-23 |
| Basic package type |
Lead-Frame SMT |
| Number of pins |
3 |
| Pin shape |
Gull-wing |
| PCB |
3 |
| ears |
N/R |
| Pin spacing (mm) |
0.95 |
| Package length (mm) |
3.04(Max) |
| Package width (mm) |
1.4(Max) |
| Package height (mm) |
0.95 |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.04(Max) |
| Package Overall Width (mm) |
2.64(Max) |
| Package Overall Height (mm) |
1.12(Max) |
| Mounting surface height (mm) |
1.12(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Small Outline Transistor |
| Package series name |
SOT |
| JEDEC |
TO-236AB |
| Package outline |
Link to datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
260 |
| Wave soldering time (seconds) |
4 |
| Wave soldering temperature source |
Link to datasheet |
| Lead Finish(Plating) |
AHr |
| Plating materials |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
not applicable |
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|
PACKAGING INFO
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| Packaging Suffix |
R |
| Package |
Tape and reel packaging |
| Packing quantity |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| packaging type file |
Link to datasheet |
| Tape Type |
Embossed |
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| APPLICATIONS |
| • Portable, Battery-Powered Equipment |
| • Data Acquisition Systems |
| • Medical Equipment |
| • Hand-Held Test Equipment |
| |
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